BNET Industries
Last Fiscal Year Sales:$7.5M
- Private
- US
Dow Jones Description
3DSP Corporation is the leader in configurable, scalable digital signal processor (DSP) architecture. 3DSP develops and provides the only fully configurable DSP cores, configurable at all hardware levels down to the execution unit, instruction level configurable up to the creation of application specific instruction. All DSP cores are scalable and thus software compatible including upward compatibility throughout all core families. The performance of 3DSP's cores matches today's and tomorrow's requirements in such growing segments as broadband communication, audio and multimedia. 3DSP enables fast and easy DSP based SoC design supplying and supporting uni- and multi-core designs, multiple peripherals, microprocessor integration, intelligent bus and DMA controller via its own developed HiFI? SoC design environment. Our customers have proven their design time has been cut down by a third. 3DSP's DSP solution includes complete suites of software modules for a fast product launch in hot segments such as voice-over-packet (VoP) and Audio. 3DSP is a privately financed company, founded 1997, with 80 employees headquartered in Irvine, CA and facilities in San Jose, CA; Boston, MA; Philadelphia, PA; Munich, Germany; Tokyo, Japan; Seoul, Korea; Taipei, Taiwan.
Number of Employees 34
Peer Companies
NAICS Code Engineering Services: 541330
News & Analysis
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3dsp corp. and wipro ltd. - All News and Analysis
3DSP and Wipro Technologies Partner to Offer DSP Solutions
Business Editors IRVINE, Calif.--BUSINESS WIRE--Aug. 28, 2001 3DSP Corp., the leader in configurable digital signal processor DSP architectures, announced that Wipro Ltd., a leading software and hardware design house located in Bangalore, India, has joined its Masterpiece partnership program. The two companies are partnering in the development...
3DSP and Wipro Technologies to Offer DSP Solutions.(Brief Article)
3DSP Corp., announced that Wipro Ltd., a software and hardware design house located in Bangalore, has joined its Masterpiece partnership program. The two companies are partnering in the development of MPEG4 video software that is forward and backward compatible with the H.263 standard,...
3DSP and Wipro Technologies to Offer DSP Solutions.(Brief Article)
3DSP Corp., announced that Wipro Ltd., a software and hardware design house located in Bangalore, has joined its Masterpiece partnership program. The two companies are partnering in the development of MPEG4 video software that is forward and backward compatible with the H.263 ...
- 1
Decision Makers
| Name (plus bio) | Position |
|---|---|
| Didier Boivin | CEO |
| June Jiang | Vice President, Dsp Development and Cfo |
| Duane Smith | Vice President, Marketing & Operations |
Array
| Organization | Position | Status |
|---|---|---|
| Palo Alto Design, Inc. | CEO | Current |
| 3DSP | President | Current |
| University of Texas At Dallas | M.B.A. | Former |
| Ecole Centrale | Bachelor of Science Degree In Electrical Engineering | Former |
| The University of Texas | MBA | Former |
| Organization | Position | Status |
|---|---|---|
| 3DSP | Vice President, Dsp Development and Cfo | Current |
| The University of Texas at Austin | Bachelor of Science Degree In Electrical Engineering | Former |
Duane Smith, who assures that high quality 3DSP products and services are brought to our customers in a timely manner, brings to the company more than 30 years of experience in the semiconductor industry. With hands-on experience in startup operations, product development and marketing, and a thorough knowledge of DSP applications, Smith plans to lead 3DSP to a leadership position in DSP core licensing. Prior to joining 3DSP, Smith served as president of Telecom Tally, a publisher of market research reports and newsletters on technology-driven, end-user products. In that capacity, he implemented new market research services in the areas of digital local loop equipment, cordless phones, multifunctional peripherals and network hubs and switches, and established a Far East sales organization to support sales in Japan, Korea and Taiwan. Before joining Telecom Tally, he was a business director for the Wireless Communications Products line at Rockwell International, Semiconductor Division (now Conexant Systems). There, he increased international sales in Japan and Korea and developed market strategies which set the stage for a sustained five-year average annual growth rate of over 25 percent. Smith's background also includes applications engineering, marketing management, and industrial products management for companies such as Silicon General (now Linfinity) and Rockwell International, Inc. Smith holds a bachelor of science in electrical engineering degree from the University of Southern California and a master's degree from the Claremont Graduate School, as well as a certificate in business finance for non-financial managers from the Wharton Business School Training Program.
| Organization | Position | Status |
|---|---|---|
| 3DSP | Vice President, Marketing & Operations | Current |
| Telecomtally.Com | President | Former |
| Telecomtally.Com | I Was Business Director | Former |
| Rockwell International Corporation | Business Director | Former |
| Wharton Graduate School of the University of Pennsylvania | Business Finance for Non-Financial Managers | Former |
| Conexant Systems, Inc. | Former | |
| Claremont Graduate School | Master's Degree | Former |
| University of Southern California | Bachelor of Science In Electrical Engineering Degree | Former |
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