M.I.T. researchers have successfully etched a 25 nanometer grid onto a piece of silicon, as NewScientist.com reports, presumably opening a way to pack transistors far more densely than ever before – but that's only one hurdle out of the way. by Erik Sherman
Tool Delivers SPICE Accuracy Five to Ten Times Faster for Complex Analog/Mixed-Signal Circuits SANTA CLARA, Calif. -- Berkeley Design Automation Inc., provider of Precision Circuit Analysis[TM] technology for advanced analog and RF integrated circuits ICs, today announced that Taiwan Semiconductor Manufacturing Company Ltd. TSMC has selected the company's...
DUBLIN, Ireland -- Research and Markets (http://www.researchandmarkets.com/research/78d03b/rapid_thermal_proc) has announced the addition of the "Rapid Thermal Processing and beyond: Applications in Semiconductor Processing" report to their offering. Special topic volume with invited papers only. Heat-treatment and thermal annealing are very common processing steps which have been employed...
Supertex, Inc. (NASDAQ: SUPX), a recognizedleader in high voltage analog and mixed signal integrated circuits ICs,today introduced the TC6215, a high-speed, complementary pair ofenhancement mode MOSFETs that features low on-resistance and is well suitedfor applications including high voltage pulsers, amplifiers, and buffers. The TC6215 features a pair of high voltage,...
PETALUMA, Calif. -- Tegal Corporation (NASDAQ:TGAL), a leading designer and manufacturer of plasma etch and deposition systems, announced today that the Company had shipped a Tegal 200SE ICP deep reactive ion etch DRIE system to a leading supplier of substrates and services in the integrated circuit and MEMS sensor markets....
SAN JOSE, Calif., Nov. 3 /PRNewswire-FirstCall/ -- Monolithic Power Systems MPS , a leading fabless manufacturer of high- performance analog and mixed-signal semiconductors, will participate this month in a series of one-on-one and small group sessions at the Thomas Weisel 2008 Small/Mid-Cap One-on-One Conference. The conference will be held...
Tin-Silver-Copper SAC solder alloys have been introduced as primary alternatives to the eutectic tin-lead solder. The use of surface finishes is a very integral process in the assembly of printed circuit boards. The purpose of a surface finish in the manufacturing process is to provide and to maintain a solderable...
Agilent 4080 Series Named "Final Manufacturing - Best Tool" SANTA CLARA, Calif. -- Agilent Technologies Inc. (NYSE:A) today announced that its new family of parametric test systems, the Agilent 4080 Series, received the EuroAsia 2008 IC Industry Award for Final Manufacturing - Best Tool. The EuroAsia...
Leading Optical Transceiver Provider Chooses PHY Technology in Long Reach DWDM Applications SUNNYVALE, Calif. -- Applied Micro Circuits Corporation (NASDAQ:AMCC), a global leader in optical transport, embedded Power Architecture[R] processing and storage solutions, announced today that Civcom, a leading technology developer and manufacturer of opto-electronic components, modules and...
ST. PAUL, Minn. -- Aetrium Incorporated (Nasdaq:ATRM) today announced that it will host a live Webcast of its 2008 third quarter conference call on Thursday, October 23, 2008, at 3:30 p.m. Central Time. Results for the quarter will be released prior to the Webcast. The Webcast will be...
TriQuint's GaAs Foundry Process Technology Implemented in IPtronics ICs Used in CERN's Large Hadron Collider Project HILLSBORO, Ore. -- TriQuint Semiconductor, Inc (NASDAQ:TQNT), a leading RF front-end product manufacturer and foundry services provider, today made known its technology was used in the design of integrated circuits ICs being...
WILSONVILLE, Ore. -- Mentor Graphics Corporation (NASDAQ:MENT) today announced that TSMC and Mentor Graphics collaborated on physical verification PV solutions leveraging a new feature of the Calibre([R]) nmDRC product called "Equation-Based DRC." Equation-Based DRC allows users to check and correct issues that are very difficult to perform today with classic...
MENLO PARK, Calif. -- Unidym, Inc., a majority-owned subsidiary of Arrowhead Research Corporation (NASDAQ: ARWR), announced today that it has completed a non-exclusive license for certain intellectual property in its portfolio to one of the world's leaders in advanced semiconductor materials for high performance integrated circuits. "This licensing...
Higher I/O counts, progressive miniaturization, more reliable performance, and other demands are being impeded by circuit board cleanliness effects.(1) Contamination can severely diminish the ability to resist shorting adjacent to leads or traces and localized residue under Z-axis area arrays, quad flatpacks and chip resistors. (2) In light...
Intermediate data format IDF plug-in is the first plug-in module for PCB123. The free, downloadable import/export plug-in gives PCB designers the ability to import PCB designs for mechanical and electrical CAD systems in a bi-directional and neutral format within the Sunstone ECOsystem Design Environment. Outline definitions of PCBs based on...
HANDBOOK OF MANUFACTURING PROCESSES: HOW PRODUCTS. COMPONENTS AND MATERIALS ARE MADE. James G. Bralla. Industrial Press Inc., 989 Avenue of the Americas, New York, NY10018. 2007. 864 pages. $115. ISBN 978-0-83113179-1. This ambitious reference work is an in-depth compilation of the workings of more than 1,500 manufacturing processes in...
HANDBOOK OF MANUFACTURING PROCESSES: HOW PRODUCTS. COMPONENTS AND MATERIALS ARE MADE. James G. Bralla. Industrial Press Inc., 989 Avenue of the Americas, New York, NY 10018. 2007. 864 pages. $115. ISBN 978-0-8311-3179-1. This ambitious reference work is an in-depth compilation of the ...
In response to ever increasing demands forsmaller, more powerful and energy-efficient devices for cloud computing andhigh-performance servers, IBM (NYSE: IBM) today announced the semiconductorindustry's first computationally based process for production of nextgeneration 22nm semiconductors. Known as Computational Scaling CS -- aprocess that enables the production of complex, powerful andenergy-efficient semiconductors...
ARMONK, N.Y. & WILSONVILLE, Ore. -- IBM (NYSE: IBM) and Mentor Graphics Corporation (Nasdaq: MENT) today announced an agreement to jointly develop and distribute next-generation computational lithography CL software solutions to enhance the imaging capability of lithographic systems used in the manufacturing of integrated circuits at the 22 nanometer nm...
MILPITAS, Calif. -- Today, KLA-Tencor Corporation (NASDAQ:KLAC) introduced the Surfscan([R]) SP2XP, a new monitor-wafer inspection system for the integrated circuit IC market that builds upon the success of its sister tool with the same name, introduced last year for the wafer manufacturing market. The new Surfscan SP2XP features improved sensitivity...
Articles 2008-09-04
<< Previous
page 1 of 1
Next >>
Premier Vendor Content
Whitepapers, webcasts & resources from our Power Center Sponsors
