Resources
BNET Business Dictionary
- ASIC
- Australian Securities and Investments Commission
- ASIC definition on BNET »
BNET Resources
- sort by:
- Relevance
- Date
- Popularity
- evolution of build-up package technology and its design challenges, The
- This paper reviews sequential build-up SBU laminate substrate development from its beginning in 1988. It reports on developments in this technology for IBM applications since its adoption in 2000. These laminated substrates are nonuniform structures composed of three elements: a core, build-up layers, and finishing layers. Each element has evolved...
- Research articles 2005-07-01
- Aware Inc. Announces Availability Of ASIC Cores For DSL Chipsets; Aware's ASIC Cores Will Accelerate DSL Development for Chip Makers
- BEDFORD, Mass.--BUSINESS WIRE--Oct. 6, 1998-- Aware Inc. (NASDAQ:AWRE), a worldwide leader in DSL digital subscriber line technology for high-speed Internet access, today announced the availability of ASIC application specific integrated circuit cores for silicon providers and equipment manufacturers who wish to rapidly integrate full-rate ADSL or DSL-Lite technology into their...
- Research articles 1998-10-06
- Kawasaki Micro Improves Timing, Area, Power of ASICs with Cadence Encounter Synthesis; Encounter RTL Compiler Enhanced over 30 Production Tapeouts of ASIC Chips at KME
- SAN JOSE, Calif. -- Kawasaki Microelectronics, Inc. of Japan KME and Cadence Design Systems, Inc. (NASDAQ:CDNS) today announced that KME has completed more than 30 production tapeouts of ASIC chips with CadenceR EncounterR RTL Compiler global synthesis, a key technology of the Encounter digital IC design platform. On average, Encounter...
- Research articles 2005-11-09
- Nexense and Fujitsu Add Real-Time Monitoring of Vital Signs to Mobile Devices; Companies to Manufacture New ASIC Chip Set for Non-intrusive Vital Signs Monitoring
- NEW YORK -- Nexense, an emerging sensing technology and research and development company, has chosen Fujitsu to develop and manufacture a new ASIC chip set for non-intrusive monitoring and tracking of vital signs via mobile phones.
- Research articles 2004-10-05
- Wi-LAN Cuts W-OFDM Engine Costs by More Than 70 Percent With First ASIC Chip of its Kind
- Business Editors
- Research articles 2000-08-02
- IBM and LSI Logic Announce Technology Licensing Agreement; ASIC Leaders to Broaden Use of ZSP DSP Technology in Custom Chips
- Business Editors
- Research articles 2001-01-22
- VIPswitch Partners With Xilinx to Move Beyond Asics for Optical Switch/Routing; Remotely Programmable Chips are a Perfect Fit for New Line of Optical Terabit Routers
- Business & High Tech Editors
- Research articles 2001-03-28
- IMS and Schlumberger Team Up to Deliver Virtual Test Solution for Sun Microsystems' Next-Generation SPARC and ASIC Chips
- BEAVERTON, Ore.--BUSINESS WIRE--Oct. 12, 1998--
- Research articles 1998-10-12
- Sun Standardizes on Schlumberger Leading-Edge Test Systems for Next Generation SPARC and ASIC Chips
- SAN JOSE, Calif.--BUSINESS WIRE--Jan. 20, 1998--
- Research articles 1998-01-20
- Single-chip solution for passive keyless entry: combines analog front end, microcontroller in one package.(ELECTRONICS)
- Engineers designing radio frequency systems for passive keyless entry and tire pressure monitoring may now be able to swap two chips for one, thanks to a new device that combines a microcontroller with a three-channel analog transponder. Know ...
- Research articles 2005-09-26
- Qualified ASIC packaging capability.(Integrated Circuits & Semiconductors)
- Aeroflex has announced qualification of its RadHard ASIC packaging capability for desirable SSO simultaneous switching output response. An external chip capacitor attachment is available for UT0.05 [micro]n RadHardASICs and FPGA-to-ASIC conversions Aeroflex has announced qualification of its RadHard ASIC packaging capability for desirable SSO (simultaneous...
- Research articles 2005-05-15
- New Strategic Relationships Enhance Synplicity's ASIC Synthesis Offering; Fujitsu and Chip Express Support the Synplify ASIC Product
- Business/Technology Editors
- Research articles 2002-03-04
- New Lucent chip doubles voice, data capacity. (News).
- MURRAY HILL, N.J.--Lucent Technologies Inc. released a new chip the company said will work as a smart antenna for CDMA networks, doubling the networks' capacity for voice and data traffic. The new application-specific integrated circuit will w MURRAY HILL,...
- Research articles 2002-12-23
- IBM, Xilinx Shake Up Art of Chip Design With New Custom Product; Embedding Xilinx FPGA Technology Into IBM ASICs to Offer Designers Unprecedented Flexibility
- Business/High Tech Editors
- Research articles 2002-06-24
- Tenor Networks Announces Technology Agreement With IBM; IBM to Manufacture ASIC Chip Set and Supply PowerPC Processors for Tenor's Optical Service Switch
- Business/Technology Editors
- Research articles 2000-05-23
- Sun woos NEC for new MPU - Sun Microsystems' negotiating with NEC's ASIC manufacturing division to manufacture next-generation, mid-range Sun UltraSparc chip - Company Business and Marketing
- Mountain View, Calif.--Sun Microsystems is currently negotiating with NEC's ASIC manufacturing division in Japan to do foundry work for Sun on a next-generation, mid-range Sun UltraSparc chip that is currently under development.
- Research articles 1996-01-15
- Whitetree Signs Agreement With Texas Instruments To Produce Next Generation Network Switching Chip; Whitetree's New ASIC To Provide Core For Next Generation Of Ethernet/ATM Switching Products
- MOUNTAIN VIEW, Calif.--BUSINESS WIRE--Dec. 16, 1996--Whitetree Inc., (formerly Whitetree Network Technologies Inc.), the pioneer of Ethernet and Asynchronous Transfer Mode ATM adaptable switching technology, today announced it has signed an agreement with Texas Instruments to produce a new generation of Ethernet and ATM network switching silicon.
- Research articles 1996-12-16
Additional Resources
- AT-to-SCSI links get smaller; SCSI II next; GRiD Tempest laptop uses Adaptec chip. (AT-to-SCSI adapter chips and chip sets)
- AT-to-SCSI links get smaller; SCSI II next IC makers are readying a collection of AT-to-SCSI chips and chip sets that improve performance, save precious board space, cut development time, and obviate the expense of ASIC designs. Transfer rates range AT-to-SCSI links get smaller; SCSI II...
- Research articles 1990-06-14
- Tower Semiconductor and Chip Express Sign Wafer Supply Agreement
- MIGDAL HAEMEK, Israel and SANTA CLARA, Calif.--BUSINESS WIRE-- Sept. 25, 1997-- Companies Formalize Existing Relationship with Multi-Year Stock Purchase Deal Tower Semiconductor Ltd. (NASDAQ/NMS:...
- Research articles 1997-09-25
- Verific Licenses HDL Component Software to ProDesign; Verific's HDL Parsers Enable New ASIC Verification Capabilities For ProDesign's CHIPit High-Speed ASIC Prototyping Systems
- ALAMEDA, Calif. -- Verific Design Automation today said that it has licensed its hardware description language HDL Component Software to ProDesign, a leading supplier of high-speed application specific integrated circuit ASIC and system-on-chip SoC verification platforms.
- Research articles 2006-03-28
- << Previous
- page 1 of 1
- Next >>
Premier Vendor Content Whitepapers, webcasts & resources from our Power Center Sponsors
