Broadcom Corp.

William Wu is a senior principal scientist at Broadcom Corporation. He is currently involved in chipset architecture/mico-architecture definition. Aside from Broadcom, he has over 18 years of experience at National Semiconductor Corporation, PLX Technology, Intel and AT&T Bell Lab, in a variety of positions from design to architecture. He holds over 18 patents relating to chipsets, PCI, AGP and system/front side buses. William Wu holds a Ph. D. degree in Electrical/Computing Engineering from University of Michigan, an M.S.E.E. degree from Carnegie Mellon University and a B. S.E.E. degree from University of Minnesota.

Robert E. Switz was named Chairman of ADC (NASDAQ: ADCT) in July 2008 and has served as President and Chief Executive Officer since August 2003. Switz has played an instrumental role in transforming ADC in recent years, developing and implementing strategies that enabled the company's return to profitability in the broadband marketplace and securing the company's position as one of the leading global providers of network infrastructure for communications service providers. He has led ADC to five straight years of revenue growth, improved profitability and increased cash flow by strategically aligning the company with the high-growth segments of fiber-based and wireless communications networks. Prior to his President and CEO positions, Switz served ADC as Executive Vice President and Chief Financial Officer of the company. He joined ADC as CFO in January 1994 and has also served the company as Sr. Vice President and Executive Vice President during his tenure. Throughout his ADC career, Switz has held leadership responsibilities for numerous critical functions including strategic planning, business development, corporate technology, marketing communications, sales operations, and information systems. As President of ADC's Broadband Access and Transport Group, he led the company's second largest operating group to revenues of $1.0 Billion in fiscal year 2000. Before joining ADC, he served as Vice President, European Operations, Ventures & Finance (CFO) at Burr-Brown Corporation, Tucson, Ariz. At Burr-Brown, he had management responsibilities for five start-up ventures and seven European manufacturing and distribution subsidiaries. He also held responsibility for corporate finance, legal, MIS, accounting, purchasing, physical resources, facilities, investor relations and business development. He served Burr-Brown from 1988 to 1994. Prior to Burr-Brown, Switz held senior financial management positions at Gulfstar Inc. (1986-1988) PepsiCo (1985-1986), AMF (1979-1985) and Olin Corporation (1971-1979). Switz serves as a director on the boards of Micron Technology, Inc. (NYSE: MU), Broadcom Corporation (NASDAQ: BRCM) and the Telecommunications Industry Association (TIA). He received recognition as a Finalist in American Business Awards for Best Executive in 2004 through 2008 and Best Turnaround Executive in 2005 through 2008. In 1999, he was a recipient of the CFO Excellence award from CFO Magazine. He holds an MBA in Finance from the University of Bridgeport as well as a B.S. in Marketing/Economics from Quinnipiac University in Hamden, Conn.

Lanny Ross has been a highly visible leader in the semiconductor industry and has more than 30 years of experience guiding semiconductor companies through various stages of growth. Mr. Ross was president and chief executive officer of Broadcom Corporation, where he continues to serve as a member of its board of directors. Before joining Broadcom, Mr. Ross served as the president of Rockwell International's Telecommunications Group. Earlier positions held by Ross include vice-president and general manager of National Semiconductor's ASIC business; vice-president and general manager of Fairchild Semiconductor's ASIC division; and from 1978 to 1982, vice president and general manager of the Fairchild Semiconductor Test Systems division.

IRVINE, Calif., Nov. 12 /PRNewswire-FirstCall/ -- Broadcom Corporation (Nasdaq: BRCM), the leading provider of integrated circuits enabling broadband communications, today announced that Alan E. "Lanny" Ross, a member of its Board of Directors, has assumed a full-time role as interim Chief Operating Officer, in charge of internal operations. "Lanny has been involved with the company for many years as an adviser and as a very active board member," said Dr. Henry T. Nicholas III, Broadcom's President and CEO. "Recently, we have asked him to increase his involvement as we have undertaken our company-wide cost cutting and restructuring efforts. Although previously retired, Lanny has now agreed to join Broadcom full time on an indefinite basis, to run our internal operations and to help recruit and expand our senior executive staff." "Lanny's extensive experience in managing the operations of semiconductor companies in various stages of growth will serve Broadcom and its shareholders extremely well as we take the company to the next level. We are fortunate now to have Lanny on a full-time basis," Dr. Nicholas said. Mr. Ross, who was elected to Broadcom's Board of Directors in 1995, served for many years as the President of Rockwell International's Telecommunications Group, which included the Newport Beach-based semiconductor operation. Under Mr. Ross's leadership, Rockwell's semiconductor revenue grew from $140 million to more than $1 billion and Rockwell became the worldwide leader in voiceband modems. He retired in 1995. Later Rockwell spun off its semiconductor operations to the public to launch Conexant Systems. Before joining Rockwell, Mr. Ross served as Vice President and General Manager of National Semiconductor's ASIC business, and prior to that was Vice President and General Manager of Fairchild Semiconductor's ASIC division. During 1978-1982, he was Vice President and General Manager of the Fairchild Semiconductor Test Systems division, a manufacturer of computer-aided semiconductor test systems. During 1994, he served as Chairman of the Board of the Semiconductor Industry Association, the premier trade association representing the U.S. microchip industry. Mr. Ross also served on the Board of Sematech as well as the Telecommunications Industry Association. "Broadcom's track record for entering new markets and then quickly establishing itself as the market leader speaks for itself," Mr. Ross said. "I'm very excited to have the opportunity to apply my operational experience to help scale the operations of this great company as its new emerging markets transition to volume production." Mr. Ross will remain on Broadcom's Board of Directors, but has resigned from the Board's Audit Committee.

Dr. Henry Samueli is Co-Founder, Chairman, and Chief Technical Officer (CTO) of Broadcom Corporation. The Office of the CTO is responsible for driving the vision of Broadcom's research and development activities as well as helping coordinate corporate-wide engineering development strategies. Dr. Samueli has over 25 years of experience in the fields of communications systems engineering and digital signal processing. Dr. Samueli has served as CTO since the Company's inception in August 1991. He served as Co-Chairman from August 1991 until May 2003 and Chairman since May 2003. He also served as Vice President of Research & Development from August 1991 until March 2003. Since 1985 Dr. Samueli has been a professor in the Electrical Engineering Department at the University of California, Los Angeles (UCLA), where he has supervised advanced research programs in broadband communications circuits and digital signal processing, and he has published over 100 technical papers in these areas. Dr. Samueli has been on a leave of absence from UCLA since 1995. Dr. Samueli was the Chief Scientist and one of the founders of PairGain Technologies, Inc., a telecommunications equipment manufacturer in the digital subscriber line (DSL) industry, and he consulted for PairGain from 1988 to 1994. From 1980 until 1985 Dr. Samueli was employed in various engineering management positions in the Electronics and Technology Division of TRW, Inc., where he was responsible for the development of military broadband communications systems. Dr. Samueli received a B.S., M.S. and Ph.D. in Electrical Engineering from the University of California, Los Angeles. He is a named inventor in 22 U.S. patents. He is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE), a Fellow of the American Academy of Arts and Sciences, and a Member of the National Academy of Engineering.

Bill Ruehle is the Senior Vice President and Chief Financial Officer (CFO) for Broadcom Corporation. Mr. Ruehle is responsible for overseeing the long-term financial development of the company in multiple high-growth markets, interfacing with the financial comm... Spoke members can see full bio. Click to join.

The Wireless Connectivity Group headed by Bob Rango is responsible for pursuing end-to-end wireless opportunities for the home, business and mobile markets. The Group oversees Broadcom's 802.11/Wi-Fi , Bluetooth , and Voice over IP (VoIP) products. Wireless connectivity products can be found in mobile handsets, notebook and desktop computers, IP phones, home gateways, and other wireless-enabled consumer electronics and peripherals, such as printers, game platforms, and keyboards. Mr. Rango joined Broadcom in March 2002 and became Vice President and General Manager of the Network Infrastructure Business Unit in October 2002. In September 2003 Mr. Rango was elected to the position of Group Vice President, Mobile & Wireless Group. Previously, from 1995 to 2002 Mr. Rango held several Vice President and General Manager positions at Lucent Microelectronics, a networking communications company, and Agere Systems, a semiconductor manufacturer, in their Optical Access, New Business Initiatives and Modem/ Multimedia Divisions. Previously, Mr. Rango held various positions with AT&T Bell Labs for over ten years. Mr. Rango received a B.S.E.E. from the State University of New York at Stony Brook and an M.S.E.E. from Cornell University.

Tom Lagatta is the Senior Vice President of Worldwide Sales for Broadcom Corporation. Mr. Lagatta is responsible for overseeing worldwide sales operations, including developing and executing the company's sales strategy and continuing to build and strengthen its world-class sales team. Mr. Lagatta has more than 26 years of industry experience. Mr. Lagatta joined Broadcom in May 2002 and became Senior Vice President, Enterprise Computing Group in September 2003. In June 2006 Mr. Lagatta was elected to the position of Senior Vice President, Worldwide Sales. Previously, from August 1999 to February 2002 Mr. Lagatta served as Vice President and General Manager of Anadigics, Inc., a semiconductor manufacturer, where he led the Fiber Communications Products Business Unit. Before joining Anadigics, from 1998 to July 1999, Mr. Lagatta served as Vice President of Business Development at Avnet, Inc., an electronic component manufacturer. Prior to Avnet, Mr. Lagatta served in various senior management and technical positions for over 11 years at Symbios Logic, a storage systems company. Mr. Lagatta received a B.S.E.E. from Ohio State University and an M.S.E.E. from the University of Southern California.

After earning his Master's degree from the University of Twente, the entrepreneurial research university in the Netherlands, Pieter Vorenkamp went to work for Philips Research. That was where he met Klaas Bult, another talented Dutch engineer who currently serves as VP & CTO, Central Engineering for Broadcom and is located in the Netherlands. Klaas left Philips Research to teach at the University of California, Los Angeles (UCLA), which ultimately served as his connection to Broadcom.

Rich is Broadcom's vice president and chief technical officer for the broadband communications group. As a member of the executive management team, he coordinates and promotes advanced developments of new technologies including advanced Physical Layer cable transmission technology to leverage product and partnership solutions to the integration of data, voice, and video applications and services. He also represents the company in several national and international standards development organizations and industry consortia. Dr. Prodan has played an instrumental role establishing the next generation DOCSIS 2.0 and 3.0 cable modem standards working with CableLabs and industry representatives from suppliers and cable operators. Previously as CTO of CableLabs, he characterized bi-directional cable plant transmission in cable systems across the US and Canada. In addition, he worked over eight years with the FCC Advisory Committee on Advanced Television Service to develop and test HDTV systems for the US. Prior to joining the cable industry, he worked in the consumer electronics industry at Philips Research Laboratories on Compact Disc and Digital Television. Dr. Prodan holds a Ph.D. in electrical engineering from Columbia University. His bachelor's and master's degrees in electrical engineering are both from City College of New York.

Mr. Andrew, 36, joins Broadcom from the St. Louis, Missouri, headquarters of A.G. Edwards & Sons, one of the oldest and largest U.S. retail brokerages, where he served as Vice President, Senior Semiconductor Research Analyst. Working within the firm's Semiconductor Group, Mr. Andrew was responsible for coverage of the communication semiconductor and equipment industries, and has been active in coverage of the technology sector since joining A.G. Edwards in 1989. Mr. Andrew is responsible for developing and implementing Broadcom's investor relations strategy and its day-to-day contacts with the investment community. He reports to Chief Financial Officer William Ruehle. Mr. Andrew is a graduate of the University of Tulsa, where he earned his bachelor's degree in business administration. He has an MBA from St. Louis University, and has attained the designation of Chartered Financial Analyst. "Peter has an in-depth knowledge of the markets we serve and has proved his expertise in communicating both general market and company-specific knowledge to a broad range of institutional and retail clients," said Mr. Ruehle. "His thorough knowledge and understanding of Broadcom's products, markets and mission will serve the company, the investment community and individual investors well." About Broadcom Broadcom Corporation is the leading provider of highly integrated silicon solutions that enable broadband communications and networking of voice, video and data services. Using proprietary technologies and advanced design methodologies, Broadcom designs, develops and supplies complete system-on-a-chip solutions and related hardware and software applications for every major broadband communications market. Our diverse product portfolio includes solutions for digital cable and satellite set-top boxes; cable and DSL modems and residential gateways; high-speed transmission and switching for local, metropolitan, wide area and storage networking; home and wireless networking; cellular and terrestrial wireless communications; Voice over Internet Protocol (VoIP) gateway and telephony systems; broadband network processors; and SystemI/O™ server solutions. These technologies and products support our core mission: Connecting everything®.

The Mobile Platforms Group headed by Yossi Cohen includes Broadcom's mobile communications and mobile multimedia lines of business. This Group is responsible for the next generation of high-speed mobile technologies and offers products for WCDMA, EDGE, and GPRS handsets along with a portfolio of mobile multimedia processors. End products include processors and software that support new applications for many high-volume end markets including mobile phones, mobile TVs, data cards, and portable audio/video/game devices. Mr. Cohen has managed a number of successful businesses at Broadcom for nine years, most recently as Vice President and and General Manager of Broadcom's Bluetooth products. Prior to managing the Bluetooth Business Unit, Mr. Cohen initiated the company's Gigabit Controller business and helped the Broadcom team drive it to a #1 market share in a highly competitive market. In his earlier years at Broadcom, Mr. Cohen was the Director of Marketing of the Networking Business Unit during the hyper-growth period, and was instrumental in growth of Broadcom's market position from a new entrant in 1998 to the largest supplier of transceivers and integrated switches two years later. Prior to joining Broadcom, Mr. Cohen held various management positions at National Semiconductor, including Director of Product Management of the Networking Business Unit. He holds a BSEE degree from the Technion - Israel Institute of Technology, in Israel.

The Broadband Communications Group headed by Dan Marotta is responsible for driving Broadcom's vision for enabling broadband services to and throughout the home, with end products and end markets focused on providing complete solutions to cable, xDSL and satellite broadband and broadcast access networks. Products from this Group are found in cable and DSL modems and gateways; digital cable and satellite set top boxes; digital TV; cable modem termination systems (CMTS) used by cable providers at their head-end equipment locations; and DSL access multiplexers used by service providers. Mr. Marotta joined Broadcom in October 2002 and became Vice President and General Manager of the Broadband Communications Business Unit in January 2003. In September 2003 Mr. Marotta was elected to the position of Group Vice President, Broadband Communications Group. Previously, from March 1999 to April 2002 Mr. Marotta served in various senior management positions in the Digital Information Division at Conexant Systems, Inc., a semiconductor manufacturer, the most recent of which was Senior Vice President and General Manager. In May 2002 Mr. Marotta was promoted to Chief Operating Officer of the Broadband Communications Segment at Conexant. Prior to joining Conexant, from 1996 to 1999 Mr. Marotta served as Director of Engineering at Brooktree Corporation, a semiconductor manufacturer, and later as Vice President of Engineering at Rockwell Semiconductor Systems, after Rockwell Semiconductor acquired Brooktree in 1996. Mr. Marotta received a B.S.E.E. from the State University of New York at Buffalo.

George L. Farinsky has been a director of the Company since February 2002. Mr. Farinsky has been an investor and consultant since he retired as a corporate financial executive in 1991. From 1987 to 1991 he was Executive Vice President and Chief Financial Officer of Ashton-Tate Corporation. Prior to joining Ashton-Tate, Mr. Farinsky held executive management positions at the Bank of British Columbia, Dysan Corporation, Kaiser Resources, Ltd., Kaiser Industries Corporation, Mattel, Inc. and Teledyne, Inc. Mr. Farinsky holds a B.S. in Business Administration from the University of San Francisco and is a Certified Public Accountant licensed in California, but is not engaged in public practice.

Degrees: Dipl.Ing. in Electrical Engineering, Technical University, Vienna; Ph.D. in Electrical Engineering, Swiss Federal Institute of Technology, Zurich Specialty: Digital transmission theory Invention: Trellis-coded modulation In 1967, when Ph.D. student Gottfried Ungerboeck became a research staff member at the IBM Zurich Research Laboratory in Rueschlikon, Switzerland, he worked on digital signal processing and switching systems. Then, he turned his talents to communication and information theory. He went on to develop digital signal processors and invent trellis-coded modulation. After rising to the rank of Fellow at IBM, Dr. Ungerboeck joined Broadcom in 1998 as a technical director dealing with "last mile" technologies. He saw Broadcom as a company that was determined to be the leader in communications chip development. "Broadcom's ability to take an idea and implement it is excellent," says Gottfried. "This company is determined to do these things. A key competitive advantage is that we are aiming at the broadest portfolio of products within this industrial segment: chips for communication." Gottfried spends 75 percent of his time at his home office in Switzerland, and 25 percent of his time in Irvine. As Technical Director, his role is essentially self-driven. He finds problems to solve and addresses them. More often than not, Gottfried finds himself working on seemingly impossible challenges. "Right now I'm working on 10-Gigabit transmission over twisted pair cable," says Gottfried. "Three years ago, I recall saying

IRVINE and SANTA CLARA, Calif., Aug 8, 2003 /PRNewswire-FirstCall via COMTEX/ -- Broadcom Corporation (Nasdaq: BRCM) and Intel Corporation today announced they have settled all outstanding litigation between the companies as well as all litigation involving their affiliates. Broadcom, Intel and certain of their subsidiaries have been engaged in several patent lawsuits in the federal courts as well as proceedings in the International Trade Commission. Under the settlement agreement, all outstanding claims and counterclaims in those actions will be dismissed with prejudice. The parties also entered into reciprocal releases covering all patent claims and certain other claims. In connection with the settlement, Broadcom will pay Intel $60 million in cash in two equal installments in the third and fourth fiscal quarters of 2003. Additionally, Broadcom and Intel entered into a separate comprehensive cross-license agreement covering patents owned or controlled by either party or its subsidiaries, and having a first effective filing date, at any time through August 7, 2008. Under the agreement, products of each party and its subsidiaries are licensed under the patents of the other for the respective lives of the patents. All existing products of each party are licensed by the other. Certain proprietary products of each party are not licensed to the other, but neither company believes that the license exceptions are material to its business as currently conducted or planned. No fees or royalties are payable by either party with respect to its business as currently conducted or planned. The companies each expressed satisfaction with the litigation settlement as well as the patent cross-license agreement. Broadcom said that it will take a one-time charge for the $60 million settlement payment in its financial statements for the fiscal quarter ended June 30, 2003, which the company expects to file with the Securities and Exchange Commission on Form 10-Q on or before August 14, 2003.

IRVINE, Calif., May 24, 2004 /PRNewswire-FirstCall via COMTEX/ -- Broadcom Corporation (Nasdaq: BRCM), a leading provider of highly integrated semiconductor solutions enabling broadband communications, today launched the enterprise storage industry's first 4 Gigabit per second (Gbps) Fibre Channel fabric switches. These new devices fulfill the demand for an affordable storage and server Fibre Channel fabric interconnect for the rapidly growing small-to-medium sized business (SMB) segment and for embedded applications. In addition, they are designed to enable the replacement of traditional loop-switch architectures in high-density enterprise storage arrays. Through the introduction of these products, Broadcom is squarely positioned to take advantage of two major trends in storage area networks (SANs): the rapid growth of Fibre Channel for SMB and the transition to 4 Gbps Fibre Channel. With the goal of increasing the overall size of the Fibre Channel market, Fibre Channel manufacturers are pushing their technology, previously deployed mainly in large enterprise networks, down into the widely untapped and growing SMB segment. The second major trend is that of storage original equipment manufacturers (OEMs) introducing higher performance products at price points previously associated with lower data transmission speeds, to increase end-customer value and preserve overall average sale prices. The industry adoption of 4 Gbps Fibre Channel products at 2 Gbps price points is expected to duplicate the highly successful and similar transition to 2 Gbps from 1 Gbps Fibre Channel. Industry analyst firm IDC projects that Fibre Channel SMB port sales will grow at a nearly 80 percent compound annual growth rate (CAGR) through 2008. According to Gartner/Dataquest, 4 Gbps Fibre Channel will grow at a CAGR of nearly 300 percent through 2007 and become the dominant speed for new Fibre Channel products in two years' time. The BCM8440: Full Featured Fabric Switch for Economical Storage Networks The Broadcom® BCM8440 fabric switch, introduced today, addresses the rapid growth of Fibre Channel in price-sensitive segments such as SMB and embedded applications. It provides a standards-compliant, full-featured solution that doubles the performance of fabric switches available on the market today. Its low power and minimal board space requirements make the BCM8440 well suited for embedded applications and network half-rack form factors - ideal for deploying redundant networks as two identical switches can now be placed side by side on one rack shelf. "The SAN switch market is migrating rapidly to 4 Gbps," said Steve Rago, Principal Analyst with the Networking and Optical Communications Analysis Service at the market research firm iSuppli Corp., El Segundo, Calif. "The first company to offer a 4 Gbps solution for the small-to-medium sized business market will have a competitive advantage over its competition." The BCM8441: Fabric Switch for High Density Storage Arrays