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chip and interdigital communications corp.

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Semiconductor IP Players: InterDitigal and Tessera
Sramana Mitra submits: InterDigital, Inc. (NASDAQ:IDCC) reported a strong second quarter on August 6. Added to the positive news in two major cases, its shares soared to a 52-week high of $28 on July 31. InterDigital is a top five beneficiary of the 3G iPhone, as its licensing technology...
Tags: Chip, InterDigital Communications Corp., Tessera Technologies
External links 2008-08-10
Top 10 Semiconductor Stocks
Sramana Mitra submits: Most of the growth in the semiconductor industry these days is due to consumer products. Semiconductor companies stand to gain from the iPhone phenomenon and the convergence device movement, which is only at the beginning of its incredible growth curves. I recently listed the 3G...
Tags: Qualcomm Inc., Chip, Broadcom Corp., InterDigital Communications Corp., Infineon Technologies AG, Intel Corp., Marvell Technology Group Ltd., NVidia Corp., STMicroelectronics, Tessera Technologies, Texas Instruments Inc.
External links 2008-08-13

Additional Resources

Licensing fight between Penn.-based InterDigital Communications,
InterDigital Communications Corp. and Samsung Electronics Co. sued each other after failing to agree on licensing terms for the newest generation of mobile-phone handsets. InterDigital, of King of Prussia, Penn., a developer of software and chips for wireless Internet access, said it filed suit in federal court in Wilmington, Del.,...
Articles 2007-03-26
Shares Drop Alongside Tempurature.
M2 PRESSWIRE-2 November 2006-bellwetherreport.com: Shares Drop Alongside TempuratureC1994-2006 M2 COMMUNICATIONS LTD RDATE:02112006 InterDigital develops and licenses circuitry designs, software, and other technology using CDMA and TDMA (code- and time-division multiple access) wireless telecommunications standards. InterDigital is developing semiconductors and software...
Articles 2006-11-02
DOD mobile satellite, radio communications will use 3G.(Military)(InterDigital Communications Corp.)(Brief Article)
Third-generation wireless chip designs and software for the Defense Department's narrowband satellite communications and joint tactical radios will be ready within about 18 months, according to InterDigital Communications Corp.'s Rip Tilden. Tilden, InterDigital's chief operating officer, said the Valley...
Articles 2005-02-01
Editorial index.
* ANTENNAS Golubicic, Zoran, Sasa Dragas and Zoran Cvetkovic "A K- and Ka-band Vehicular Phased-array Antenna," No. 1, p. 58. Jang, Yong-Woong "Presentation of a Numerical Simulation and Experimental ...
Articles 2004-12-01
Mentor Graphics Announces Winners of Its 18th Annual PCB Technology Leadership Awards
Business Editors/High-Tech Writers SAN JOSE, Calif.--BUSINESS WIRE--March 18, 2004 Continuing its tradition of promoting and recognizing printed circuit board PCB designer excellence, Mentor Graphics Corporation (Nasdaq:MENT) announced the winners of its 18th Annual PCB Technology Leadership Awards at a banquet in coordination with...
Articles 2004-03-18
Infineon Announces Second Quarter Results
Business Editors/High-Tech Writers MUNICH, Germany--BUSINESS WIRE--April 24, 2001 Infineon (NYSE:IFX) -- Second quarter revenues up 8 percent year-on-year to Euro 1.65 billion;maintaining the level of previous quarter revenues in a difficult marketenvironment-- Revenues increase in all business segments from previous quarter exceptwireless communications...
Articles 2001-04-24
Infineon, InterDigital announced partnership.
MUNICH, Germany--Infineon Technologies AG and InterDigital Communications Corp. announced a long-term partnership to develop enabling software for third-generation mobile products. The software they create will be incorporated into Infineon's standard 3G System-on-a-Chip Integrated Circuits for mobile terminals. In addition, InterDigital will...
Articles 2001-04-09
Infineon and InterDigital Establish Strategic Partnership to Develop 3G Technology and Products.(Infineon Technologies AG, InterDigital Communications Corporation, third-generation)(Brief Article)
Infineon Technologies AG and InterDigital Communications Corp. have announced a broad long-term strategic partnership to develop enabling software for third-generation (3G) mobile products. The software will be incorporated into Infineon's standard 3G system-on-a-chip SoC integrated circuits ICs for mobile terminals...
Articles 2001-04-01
PERSONNEL.(brief industry personnel information)
* Harmonix Corp. has promoted Dana E. Wheeler to chief operating officer. Previously, Wheeler served as VP of business development. * Smart antenna start-up Antenova has announced its management team. Graham Cooley was appointed CEO, Anthony Winter non-executive chairman and...
Articles 2001-01-01
InterDigital Unveils Expanded U1WIS Product Portfolio
InterDigital Communications Corp. plans to expand its UMTS product portfolio to serve the 3G wireless market. In addition to continuing to develop system on a chip SoC modems for mobile end user devices, the company now intends to expand its product portfolio to include base stations modems and radio resource...
Articles 2000-11-01
InterDigital plans 3G chip solution.
BARCELONA, Spain--InterDigital Communications Corp. announced plans to make third-generation technology and product design easier and faster using its system-on-a-chip solution to test both software and hardware as though they were operating within a full system in a real environment. "As changes...
Articles 2000-10-16
High-Speed Decoupler in an 0508 Package has Lowest Inductance of Any FR4 Mountable Capacitor
MYRTLE BEACH, S.C.--BUSINESS WIRE--Aug. 30, 1999-- AVX adds 0508 size to range of ultra-low inductance IDC chips... AVX Corp. (NYSE: AVX) has expanded its line of Inter-Digitated Capacitors IDCs to include an 0508 chip with a measured inductance of 110pH, giving it the...
Articles 1999-08-30
InterDigital Plans to Report Stronger Than Expected 1998 Results: End of Year Royalty Agreements Increase 1998 Licensing and Alliance Revenue to $92 Million
KING OF PRUSSIA, Pa.--BUSINESS WIRE--Jan. 28, 1999--InterDigital Communications Corp. (ASE:IDC) announced Thursday that it expects to report stronger than anticipated earnings for the fourth quarter and full year of 1998 following the signing of two agreements for royalty payments from existing licensees. The Company now...
Articles 1999-01-28
InterDigital chooses LSI Logic to develop and manufacture chip technology for B-CDMA wireless products
KING OF PRUSSIA, Pa. and MILPITAS, Calif.--BUSINESS WIRE-- Feb. 15, 1996--InterDigital Communications Corp. (ASE:IDC) and LSI Logic Corp. announced Thursday that they have entered into an agreement which provides for the development and production of custom chips by LSI Logic for InterdigitalR. The chips will incorporate InterDigital's proprietary Broadband Code...
Articles 1996-02-15
Sensors unite for process improvement. (Cover Story)
Industrial engineers are improving production management by adding sensors to production lines. The sensors consist of applications of signal conditioners, semiconductors, and networking media. The sensors collect more information over a wider variety of parameters. By increasing the number of measurements of the production process, managers have a wider...
Articles 1992-09-01
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