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- Formation of World's Leading Advanced Packaging Group: Datacon Business Group Merges With BE Semiconductor Industries N.V. - Besi
- RADFELD, Austria -- BE Semiconductor Industries N.V. Besi, a well established manufacturer of assembly equipment for the semiconductor industry, and Datacon Technology AG Datacon, expert in microchip assembly platforms die bonders, announced today that both business groups will merge to form a leading global advanced packaging supplier. Besi will take...
- Research articles 2004-11-11
Additional Resources
- EV Group , a wafer-bonding and lithography equipment suppler, and Datacon Technology AG , a flip-chip and die bonding equipment supplier, will develop and market advanced-chip-to-wafer technology
- EV Group (evgroup.com), a wafer-bonding and lithography equipment suppler, and Datacon Technology AG (datacon.at), a flip-chip and die bonding equipment supplier, will develop and market advanced-chip-to-wafer (AC2W) technology. AC2W technology offers high device density through stacked devices, short interconnects and higher functional density, enabling the integration of various device technologies.
- Research articles 2004-12-01
- EV Group and Datacon Announce Cooperation on Advanced-Chip-to-Wafer Technology - AC2W Technology
- SCHARDING, Austria & RADFELD, Austria -- EV Group, a leading supplier of wafer-bonding and lithography equipment, and Datacon Technology AG, leading supplier of flip-chip and die bonding equipment, today announced a development agreement in the field of advanced-chip-to-wafer (AC2W) technology. The two companies also have agreed on joint strategic marketing...
- Research articles 2004-10-13
- Datacon sees growth from packaging equipment.(Assembly Lines)
- RADFELD, AUSTRIA -- Datacon Technology AG, a developer and manufacturer of high-precision die bonders and production systems for semiconductors, increased its European revenue in the automotive electronics segment more than 100 percent in the last business year. It generated nearly 50 percent of its European sales...
- Research articles 2003-07-01
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