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	<title><![CDATA[epoxy and polymer Resources | BNET]]></title>
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	<description><![CDATA[White papers, case studies, business articles, and blog posts relating to epoxy and polymer]]></description>
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		<title><![CDATA[US university gets $1 million Air Force coatings contract.(us newslines)]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_hb6471/is_200702/ai_n25767060]]></link>
		<description><![CDATA[Ypsilanti, Michigan -- The Coatings Research Institute CRI at  Eastern Michigan University EMU, based in Ypsilanti, announced 12 Dec  that it has gained a contract worth $1 million with the US Air Force.  The institute will carry out coatings research for the military branch  at Wright-Patterson...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Thu, 01 Feb 2007 23:59:59 -0800</pubDate>
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		<title><![CDATA[Raman spectroscopy in coatings research and analysis: Part II. Practical applications]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_hb3226/is_20_2/ai_n29212636]]></link>
		<description><![CDATA[In this two-part tutorial, the use of Raman spectroscopy for characterizing and testing coatings is examined. Part I covered the type of information that can be obtained using Raman spectroscopy (August 2005 JCT CoatingsTech, page 38), and described how a coating is studied in a typical Raman experiment. Part I...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Thu, 01 Sep 2005 23:59:59 -0700</pubDate>
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		<title><![CDATA[Price adjustments.(Company News)(adhesives and sealants)(Illustration)]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_hb5573/is_200409/ai_n23522358]]></link>
		<description><![CDATA[PRICE ADJUSTMENTS    COMPANY            PRODUCT                     INCREASE           DATE...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Wed, 01 Sep 2004 00:00:00 -0700</pubDate>
		<category domain="http://resources.bnet.com/topic/the+dow+chemical+co..html"><![CDATA[The Dow Chemical Co.]]></category>
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		<title><![CDATA[Curing kinetics of anisotropic conductive adhesive film]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_qa3776/is_200303/ai_n9172884]]></link>
		<description><![CDATA[Polymer-based conductive-adhesive materials have become widely used in many electronic packaging interconnect applications, such as chip-on-glass, chip-on-flex, etc. Among all the conductive-adhesive materials, anisotropic conductive adhesive film ACF is an attractive interconnect material because of its fine pitch capability. Anisotropic conductive-adhesive film is a thermosetting, epoxy matrix impregnated with a...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Sat, 01 Mar 2003 23:59:59 -0800</pubDate>
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		<title><![CDATA[Technical sessions]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_hb6619/is_3_59/ai_n28989190]]></link>
		<description><![CDATA[MONDAY MORNING  May 5  SESSION M1  Color and Appearance  Color and Appearance  Moderator: Bob Trinklein - Teknor Color  (8:00 AM) Keynote Speaker Evolution of Color Quantification Harold, Richard  #1272 (9:00AM)  Pigments for Food Packaging - A Regulatory Journey  Jackson, Donna -...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Sat, 01 Mar 2003 23:59:59 -0800</pubDate>
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		<title><![CDATA[A study of moisture diffusion in plastic packaging]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_qa3776/is_200205/ai_n9032915]]></link>
		<description><![CDATA[The absorption and desorption processes of moisture in plastic material were studied with experimental measurement and finite element FE simulation. The diffusion coefficient and the saturate concentration were determined by experiment and simulation results with Fick's law. The water molecules inside the plastic material were chemically bonded with polymers by...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Wed, 01 May 2002 23:59:59 -0700</pubDate>
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		<title><![CDATA[INDUSTRY NEWS.]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_hb5968/is_200007/ai_n24114615]]></link>
		<description><![CDATA[BASF Will Close Ohio Coatings Plant; Joint Venture in Japan Also  Announced    ORRVILLE, OH -- BASF Corp. announced plans to close its Orrville,  OH, coil-coatings manufacturing facility by late this year in a  cost-cutting move. The plant is a part of the former Morton...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Sat, 01 Jul 2000 23:59:59 -0700</pubDate>
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		<title><![CDATA[Bake Oven Induced Variation of Surface Chemistry on Electrocoat Paint: Effect on Primer-Electrocoat Intercoat Adhesion.]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_hb3503/is_200004/ai_n8301009]]></link>
		<description><![CDATA[Larry P. Haack [*]     Joseph W. Holubka [+]     INTRODUCTION     Commercial paint systems are complex assemblages comprising  multiple layers of coatings. An essential requirement of such a paint  system is that each layer performs its designated purpose,...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Sat, 01 Apr 2000 23:59:59 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/analysis.html"><![CDATA[analysis]]></category>
		<category domain="http://resources.bnet.com/topic/australian+communications+authority.html"><![CDATA[Australian Communications Authority]]></category>
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		<title><![CDATA[Development of conducting adhesive materials for microelectronic applications]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_qa3776/is_199911/ai_n8860095]]></link>
		<description><![CDATA[Electrically and/or thermally conducting adhesive materials are classified into two categories depending on their conduction modes: isotropic and anisotropic materials. Silver-particle filled epoxy is the most common example of the class of isotropic materials which are conductive in all directions. This material has been long used in the electronic applications...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Mon, 01 Nov 1999 23:59:59 -0800</pubDate>
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		<title><![CDATA[IBM develops board compound to replace epoxy - CYTUF polymer circuit-board material]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_m0EKF/is_n2015_v40/ai_15401500]]></link>
		<description><![CDATA[YORKTOWN HEIGHTS, N.Y.--IBM last week said it had developed a new polymer circuit-board material that offers many advantages over the standard epoxy material, including the bonding of computer chips directly to circuit boards and potentially eleminating an entire level of packaging.]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Mon, 23 May 1994 00:00:00 -0700</pubDate>
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