Resources
BNET Resources
- sort by:
- Relevance
- Date
- Popularity
- Eagle Group.(product marketplace)
- SpecFAB services shorten the design and fabrication process by supporting laboratory custom-design requirements: creating configurations of countertops and shelving from standard ... SpecFAB services shorten the design and fabrication process by supporting laboratory custom-design requirements: creating configurations of countertops and shelving from standard...
- Research articles 2005-08-01
- Honeywell offers new Hole Fill Process. (Up Front Industry News & Insight).(Brief Article)(Product Announcement)
- Honeywell Advanced Circuits HAC has developed a fabrication process and equipment it says is simple in design, yet delivers high-aspect ratio hole-fill capabilities at throughputs consistent with volume production demands. Honeywell Advanced Circuits HAC has developed a fabrication process and equipment it...
- Research articles 2002-04-01
- IBM automates semiconductor fab by linking RFID (Manufacturing Business Technology)
- When IBM spent $2.5 billion to refurbish its Fishkill, N.Y.-based 300-mm semiconductor fabrication facility, it had a specific goal in mind: to automate the entire fabrication process. That mission was accomplished through creative use of informatio When IBM spent $2.5 billion to refurbish its Fishkill,...
- Research articles 2006-06-01
- Lucent, Chartered Set Process Deal - Lucent Technologies, Chartered Semiconductor Manufacturing to co-develop fabrication processes - Company Business and Marketing
- Phoenix - The Microelectronics group of Lucent Technologies and Singapore silicon foundry Chartered Semiconductor Manufacturing will work together to develop fabrication processes for copper and aluminum interconnects on next-generation CMOS ICs.
- Research articles 1999-03-15
Additional Resources
- STEAG MicroTech and IMEC improve RCA Clean Process Technology; Efforts Result in Lower Cost, Smaller Footprint Manufacturing Environment
- SAN FRANCISCO--BUSINESS WIRE--July 11, 1995--Semicon West--STEAG MicroTech (Donauschingen, Germany), a semiconductor equipment manufacturer and IMEC (Leuven, Belgium), an independent semiconductor research and development organization, announced that the two companies have developed the Twin CleanTM silicon fabrication process and wet bench equipment. The process combines IMEC's CleanTM system with STEAG's...
- Research articles 1995-07-11
- JMAR Receives Additional $3.5 Million Order for Integrated Circuit and Fabrication Process Technology
- SAN DIEGO--BUSINESS WIRE--April 30, 1999-- JMAR Technologies Inc. (Nasdaq:JMAR), a growing provider of precision micro-technology products, announced that its JMAR Semiconductor Inc. JSI division has been awarded $3.5 million in additional contract funding to continue its program to upgrade and enhance a CMOS integrated circuit fabrication facility and related...
- Research articles 1999-04-30
- JMAR Receives Additional $3.5 Million Order for Integrated Circuit and Fabrication Process Technology
- SAN DIEGO--BUSINESS WIRE--April 30, 1999-- JMAR Technologies Inc. (Nasdaq:JMAR), a growing provider of precision micro-technology products, announced that its JMAR Semiconductor Inc. JSI division has been awarded $3.5 million in additional contract funding to continue its program to upgrade and enhance a CMOS integrated circuit fabrication facility and related...
- Research articles 1999-05-03
- IDT Announces Industry's First Network Search Engine Manufactured on TSMC's 90 Nanometer Process Technology; Leading Technology Innovators Leverage Intimate Knowledge of Design Expertise and Fabrication Process to Achieve Manufacturing Milestone
- SAN JOSE, Calif. -- IDTTM (Integrated Device Technology, Inc.) (NASDAQ:IDTI), the leading provider of network search engines NSEs, today announced the industry's first NSE manufactured on TSMC's Taiwan Semiconductor Manufacturing Company 90 nanometer nm process technology. This next-generation IDT device, which is now sampling, achieves new levels of performance, cost...
- Research articles 2005-12-07
- Lucent Debuts New Process
- For Communications Chips allentown, pa. -- Lucent Technologies' Microelectronics Group introduced a new fabrication process for communications chips last week. The technology, dubbed the COM-2 process, is the second generation of Lucent's modular, system-on-a-chip approach.
- Research articles 1998-09-21
- Lucent Debuts New Process - Lucent Technologies COM-2 - Company Business and Marketing
- For Communications Chips allentown, pa. -- Lucent Technologies' Microelectronics Group introduced a new fabrication process for communications chips last week. The technology, dubbed the COM-2 process, is the second generation of Lucent's modular, system-on-a-chip approach.
- Research articles 1998-09-21
- JMAR Awarded Contract to Upgrade Semiconductor Process at DMEA Installation in Sacramento; JMAR Contract with General Dynamics to Increase Productivity and Compatibility at the DMEA Production Facility
- SAN DIEGO -- JMAR Technologies, Inc. (Nasdaq: JMAR) has announced that its Microelectronics Division has been awarded a new contract totaling $603,000 to upgrade the semiconductor fabrication process installed at the Advanced Reconfigurable Manufacturing for Semiconductors ARMS foundry in Sacramento, California. General Dynamics Advanced Information Systems GDAIS, a prime...
- Research articles 2005-10-03
- JMAR Awarded Two Contracts Totaling $900K for Semiconductor Fabrication Process Installation
- Business Editors/High-Tech Writers SAN DIEGO--BUSINESS WIRE--Nov. 14, 2001 JMAR Technologies Inc. (Nasdaq NM: JMAR):-- Company Will Receive $640,000 to Install UTSi Process into Defense Department Flexible Foundry in Sacramento, Calif. -- New Funding Added to Previously Announced EEPROM Contract Brings Total to $1.6 Million JMAR...
- Research articles 2001-11-14
- Business Partnership Targets Ripple Effect of Breakthrough in Semiconductor Process Technology On Industry Supply Chain
- Business Editors & High-Tech Writers IRVINE, Calif.--BUSINESS WIRE--Sept. 4, 2002 California-Based Supply Logic Joins With Japan's Trecenti Technologies to Develop Best Practices and Customer Base for First Full Single Wafer 300mm Fab The breakthrough impact of a dramatically accelerated semiconductor fabrication process is the focus...
- Research articles 2002-09-04
- IBM automates semiconductor fab by linking RFID.(RFID IN MANUFACTURING)
- When IBM spent $2.5 billion to refurbish its Fishkill, N.Y.-based 300-mm semiconductor fabrication facility, it had a specific goal in mind: to automate the entire fabrication process. That mission was accomplished through creative use of informati When IBM spent $2.5 billion to refurbish its...
- Research articles 2006-06-01
- Building a Virtual Shop Model for Steel Fabrication
- This paper proposes a system for building virtual fabrication shop models capable of estimating, scheduling, and analyzes production. The system defines conceptual models for product, process, and the fabrication facility itself. It offers tools, such as product modeling, process modeling and planning, and a special purpose facility modeling tool, which...
- White papers 2003-10-31
- Nanowire fabrication method assembles atomic clusters.(PROCESS TECHNOLOGY)
- New nanowire fabrication technologies have reportedly been developed by NanoDynamics Inc., Buffalo, N.Y., and its New Zealand-based partner, Nano Cluster Devices Ltd. NCD. An NCD atomic cluster assembly process is based on stenciling or "shadow mask" techniques for manufacturing, a common practice in semiconductor fabrication, but...
- Research articles 2006-02-01
- New MOSIS Shared Wafer Service on IBM's 130nm 8WL Process Makes High-Performance RF Chip Fabrication Affordable
- MARINA DEL REY, Calif. -- MOSIS, a provider of low-cost prototyping and small volume production services for custom ASICs, announces prototype and low volume fabrication access to IBM's fourth generation foundry technology, 8WL, the 130 nanometer nm silicon germanium SiGe bipolar complementary metal oxide semiconductor BiCMOS process. The process uses...
- Research articles 2007-03-02
- Metal solid freeform fabrication using semi-solid slurries
- A new process for the direct solid freeform fabrication SFF of metallic prototypes and components offers a significant advantage over most other metal-SFF processes: it does not involve the use of powders, thus minimizing porosity and shrinkage distortion. This process utilizes the unique rheological and thermophysical properties of semi-solid-- metal...
- Research articles 2000-12-01
- ADF Group Inc. is in the Process of Ordering the Raw Material in Order to Start the Fabrication in October 2005 for Chicago's O'Hare International Airport
- TERREBONNE, Quebec -- ADF GROUP INC. ("ADF" or the "Company") (TSX:DRX.SV) announces today that it is in the process of ordering the raw material in order to start the fabrication in October 2005 for the Chicago's O'Hare International Airport contract announced in May 2005. ADF may...
- Research articles 2005-09-23
- ADF Group Inc. is in the Process of Ordering the Raw Material in Order to Start the Fabrication in October 2005 for Chicago's O'Hare International Airport.
- TERREBONNE, QUEBEC, Sep 23, 2005 CCNMatthews via COMTEX -- ADF GROUP INC. ("ADF" or the "Company") (TSX:DRX.SV) announces today that it is in the process of ordering the raw material in order to start the fabrication in October 2005 for the Chicago's O'Hare International Airport contract...
- Research articles 2005-09-23
- << Previous
- page 1 of 1
- Next >>
Presented by American Express