Tessera Technologies

• Public
• US

Dow Jones Description

When Tessera, Inc. was founded in 1990, we took our name from the Latin word for "tile", evoking an image of packaged chips being tiled closely together as in a mosaic. As demand for high performance, small size and better reliability in electronic devices was growing at an unprecedented rate, semiconductor companies found that silicon packaging - the physical interface between the silicon die and the circuit board - was a bottleneck that had to be overcome. To meet the need for small, fast and reliable packaging, and to make possible many of the electronic advances witnessed in the 1990s, Tessera developed packaging solutions that were virtually the same size and speed as the silicon chip itself. This technology became known as "Chip Scale Packaging" or "CSP", and the technology has become broadly adopted. In fact, one million packages using Tessera's BGA CSP technology are produced each day for products ranging from cellular phones to network servers. Today we continue our work by providing a broad range of advanced packaging solutions - from stacked chip solutions to wafer-level packaging - and a full suite of customer services that enable electronics companies to meet their growing and changing packaging needs. Tessera's CSP technology can be seen improving the life of millions of people everyday - from faster computers and network servers, to smaller cell phones and PDAs, to better MP3 players and 3-D video games.

Number of Employees 417

Contact Information

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