Integrated Device Technology

Ted Tewksbury is president and CEO of Integrated Device Technology Inc. (IDT), leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience. He joined IDT as president and CEO in March 2008 and was elected to the IDT Board of Directors in April 2008. Tewksbury brings over 20 years of experience in the semiconductor industry with extensive background in mixed signal and analog application specific standard products (ASSP). Prior to joining IDT, Tewksbury served as the president and chief operating officer of AMI Semiconductor. He also served as general manager and managing director at Maxim Integrated Products, Inc. where he managed 11 product lines, established their high-speed data converter and high-performance RF businesses, and introduced over 180 new products. Prior to that, Tewksbury served as director of SiGe RF/analog product development for IBM Microelectronics and as senior design engineer for Analog Devices. Tewksbury holds a BS, MS, and Ph.D. in Electrical Engineering from the Massachusetts Institute of Technology. He has also authored and co-authored many published articles, holds several patents and has led the development of many industry firsts and award-winning technologies.

Serving in his current position since 1987, Lien has been responsible for Process R&D development. Additionally he oversees IDT Shanghai, Corp QA, and central FA. Lien managed MIPS microprocessor, CAM, and SRAM design teams earlier in IDT. Before IDT he was a senior process engineer at Advanced Micro Devices and principal device engineer at Digital Equipment Corp. With more than 50 published technical papers and more than 100 patents awarded, Lien holds a master's degree and doctorate in electrical engineering from California Institute of Technology, as well as a bachelor's degree in electrical engineering from National Taiwan University.

Lee brings more than 27 years of semiconductor experience to IDT. As vice president of worldwide sales, Lee is responsible for the global IDT sales organization, consisting of approximately 450 direct salespeople and manufacturing representatives, and a global network of distributors in more than 50 countries. He leads and manages sales efforts with an emphasis on expanding the company's total system solutions to enable accelerated packet processing and on building customer relationships throughout key segments of the networking and telecommunications industries. Lee has served in various leadership positions during his tenure at IDT. Prior to his current position, Lee served as senior vice president and general manager of the IDT Timing Solutions Group where he led all business aspects of the company’s six timing solutions business units, targeting computing, consumer and communication markets. He also previously served as vice president and general manager of the FIFO, Timing and Telecom products division and was responsible for product development, engineering, applications and marketing. He is credited for initiating the IDT telecom products business, as well as solidifying the company’s FIFO leadership position. In 1989, Lee was director of wafer fab operations, where he led the construction of the IDT sub-micron fab in San Jose. Prior to joining IDT, Lee spent 5 years at Intel and was involved in the early research and development of flash memory technology. Along with co-authoring many technical papers for journals and conferences, Lee holds three U.S. patents. Lee received his bachelor of science degree from National Taiwan University and master of science degree from Case Western Reserve University in Ohio, both in Electrical Engineering.

As vice president of worldwide marketing, Chad Taggard leads the long-range strategic planning and corporate business development for IDT. Additionally, Taggard is responsible for IDT’s worldwide marketing efforts promoting and communicating the IDT brand presence to target audiences. Taggard brings 18 years of high tech experience to IDT. Prior to IDT, Taggard worked at Intel Corporation in a variety of roles allowing him to focus on the communications and computing segments. In both general manager and director positions Taggard’s responsibilities included product marketing and development, strategic planning and selling, manufacturing operations, business development, media and analyst relations, 3rd party alliances, channel programs and marcom activities. These activities covered a broad line of Ethernet silicon and boards, LAN-on-motherboard components, DSL, cable, v.90, home networking (802.11, HPNA, HomeRF), microprocessor, and chipset products. Prior to joining Intel, Mr. Taggard worked at Hewlett-Packard Corporation as a software engineer. Taggard received his MBA from the UCLA Anderson School of Management and his Bachelor of Science degree from Colorado State University.

In his role as Vice President and general manager of the IDT Networking Division, Derek Dicker is responsible for the marketing, product management and system architecture aspects of the business. He drives business strategy for the division with primary responsibilities including strategic and product marketing, business development, and management of customer relationships and partnerships. Dicker brings more than 10 years of semiconductor industry experience encompassing sales and business management to IDT. Prior to IDT, he held various positions in OEM sales, marketing, strategic planning and applications engineering at Intel. Dicker received his BS in Computer Science and Engineering from the University of California Los Angeles.

Fred Zust is the vice president and general manager of the IDT Communications Division focusing on mixed signal solutions for the wireless and wireline enterprise communications markets. Prior to his current position, Zust led the Networking and Communications Clock Division for IDT, also as vice president and general manager. Zust brings more than 16 years of semiconductor industry expertise to the company encompassing engineering, marketing and business management. He joined IDT in 2003 as a result of the IDT acquisition of Integrated Circuit Systems, Inc. (ICS). At ICS, he served as vice president for the NetCom Timing Division. Prior to ICS, Zust held various leadership and technical at Texas Instruments and AT&T/NCR Corp. Zust holds a BSEE from Clemson University.

As Vice President and general manager of the IDT Video & Display Operation, Ji Park is responsible for directing marketing strategy and cross functional design applications for the Displayport, LCD controller and image processing products. With more than 13 years of semiconductor industry experience, Park’s knowledge encompasses expertise in product engineering and strategic business marketing. In June 2005, Park joined IDT as Director of Memory Timing Products as a result of the acquisition of merger with Integrated Circuit Systems (ICS). Prior to IDT, Park held various management positions in product engineering, design and marketing at Texas Instruments and Applied Materials. Park earned his BS in Electrical Engineering from the University of Texas in Austin and his MBA from the University of Dallas.

Julian Hawkins brings nearly 20-years of semiconductor experience to IDT. As vice president of worldwide sales, Hawkins is responsible for the global IDT sales organization, consisting of approximately 450 direct salespeople and manufacturing representatives, and a global network of distributors in more than 50 countries. He leads and manages sales efforts with an emphasis on expanding the company's total system solutions to enable accelerated packet processing and on building customer relationships throughout key segments of the networking and telecommunications industries. Hawkins has held several senior management positions for companies in the networking and semiconductor industries. He joins IDT from Infineon Technologies, Inc., where he spent three years as vice president of sales for North America. While at Infineon, Hawkins led the company's North American sales, field application and design win teams. Hawkins' accomplishments at Infineon included increasing revenue in North America beyond double the industry growth rate and dramatically increasing the company's market share while significantly reducing sales costs. Other prior industry experience includes eight years at Samsung Semiconductor Inc., where he held various management positions, including vice president of marketing for memory and flat panel LCD sales in the Americas. Hawkins led a team of professionals covering product marketing, strategic marketing, applications engineering and product definition, and he was responsible for managing approximately $5 billion in revenue. In addition, Hawkins has held sales and marketing positions at significant semiconductor companies in all three major markets -- North America, Asia Pacific and Europe. Hawkins earned a bachelor's degree in computer science, with honors, from Manchester University.

Mike Hunter brings more than 28 years of manufacturing and operations management experience to his position as vice president of manufacturing. His duties encompass complete manufacturing responsibility for the four manufacturing sites, which include a wafer fab in Hillsboro, as well as test and assembly facilities in Penang, Manila and Santa Clara. External foundry operations and business planning also report to Hunter. Before joining IDT, Hunter gained international experience as vice president of fab operations for Chartered Semiconductor Manufacturing Ltd. in Singapore. Prior to that, he served as executive vice president of finance and senior vice president of manufacturing at Fujitsu Personal Systems, where he managed the worldwide financial and product supply activities for the company, including four European subsidiaries. Hunter has also held management positions at POQET Computer Corp., Athens Corp., National Semiconductor, Fairchild Semiconductor and Texas Instruments. Hunter received a bachelor of science degree in operations management from the University of Alabama.

Ram Iyer is the vice president and general manager of the Computing & Multimedia Division. Prior to his current position, Iyer was vice president and general manager of the IDT MicroClock Business Unit where he led all aspects of the company’s digital consumer timing products business with primary responsibilities including business development, and engineering, including design, applications, product and test. Iyer brings more than 15 years of semiconductor industry experience encompassing business and engineering management to IDT. Iyer joined IDT in September 2005 as a result of the IDT acquisition of Integrated Circuit Systems, Inc. (ICS). At ICS, he held various management positions in marketing, applications engineering and systems design positions. Before working with ICS, Iyer spent seven years at Sony Corporation in design and marketing positions. Iyer received his MBA from San Jose State University, has an MSEE from SUNY at Stony Brook and holds a BSEE degree from Bangalore University.

As vice president of human resources, Ervin is responsible for leading the global human resource function for IDT. Ervin brings more than 20 years of HR experience to IDT. Prior to joining IDT, Ervin held multiple leadership roles at Intel Corporation where he was the director of human resources for organizations including the desktop, mobile, server and communications groups. During his 10-year tenure at Intel, he participated in corporate wide strategic initiatives which included Intel mergers and acquisitions and the successful integration of multiple acquired companies. Ervin was a recipient of the prestigious Intel Achievement Award for breakthrough performance with strategic impact for development of the company’s well regarded executive development program. Prior to Intel, Ervin held various HR management and organization development roles for a variety of companies, including Mentor Graphics Corporation and Digital Equipment Corporation. Ervin earned a bachelor’s degree in psychology at the University of Northern Colorado and a master’s degree in organization development from the Graziadio Business School at Pepperdine University.

In his role as Vice President of Engineering for the IDT Networking Division, Sab Ventola is responsible for the design, development and test engineering of the business. Ventola brings more than 23 years of semiconductor and networking industry experience to IDT encompassing design engineering and strategic business marketing. Ventola joined IDT in October 2002 as a result of the IDT acquisition of Solidum Systems. At Solidum, his primary responsibility was overseeing the company’s product design and development. Prior to Solidum, Ventola held various management positions in design and marketing at Alcatel, Newbridge Networks Corporation and Mitel Corporation. Ventola holds a master’s of Engineering degree from Carleton University in Ottawa and a BASc degree in Electrical Engineering from the University of Waterloo.

In his role as vice president and general manager of the flow-control management (FCM) division, a recently formed group dedicated to developing products that enable the flow of information in networks, Thomas Brenner is responsible for driving all aspects of the flow-control management business. He manages business development, strategic and product marketing, product development and engineering, production control, and applications engineering for the flow-control management, FIFO and multi-port product areas. Brenner brings more than 15 years of semiconductor experience to IDT. He spent five years at LSI Logic where he most recently held the position of vice president and general manager of the networking ASIC division. In this role, he managed marketing, program management and system engineering teams for the company's enterprise, metropolitan area and wide area networking (WAN) businesses. Prior to joining LSI Logic, Brenner spent eight years at Philips Semiconductors with increasing responsibility in marketing and sales management roles in the United States and Europe. Brenner also previously held engineering positions at Lockheed Missiles and Space Company. Brenner received bachelor of science degrees in electrical engineering and computer science from Washington University in St. Louis, Mo.

David Maxwell is a NetBSD Developer and was a member of the NetBSD Security-Officer team from 2001-2005. He has had the opportunity to enjoy using NetBSD to make life easier for Manufacturers, Distributors, Governments, Cable Companies, ISPs, Semiconductor companies, and end-users. He currently works full time as a Software Designer for Integrated Device Technology, Inc. (IDT)

Serving in his current position since 1987, Lien has been responsible for Process R&D development. Additionally he oversees IDT Shanghai, Corp QA, and central FA. Lien managed MIPS microprocessor, CAM, and SRAM design teams earlier in IDT. Before IDT he was a senior process engineer at Advanced Micro Devices and principal device engineer at Digital Equipment Corp. With more than 50 published technical papers and more than 100 patents awarded, Lien holds a master's degree and doctorate in electrical engineering from California Institute of Technology, as well as a bachelor's degree in electrical engineering from National Taiwan University.

For more than five years, Berg has been an influential Silicon Valley industrial real estate developer and a private venture capital investor. Berg is currently chairman, CEO and director of Mission West Properties Inc. (MSW), a real estate investment company. He also serves as director of Valence Technology Inc., Monolithic Systems Inc., Focus Enhancements Inc. and Systems Integrated Research. Berg's past major investments have included Integrated Device Technology and Sun Microsystems. He holds a bachelors degree in corporate finance from the University of New Mexico, Albuquerque.

Mr. Parnell has served as Vice President and Chief Financial Officer since May 2000. He served as Vice President, Controller and Treasurer from April 1993 to May 2000. Mr. Parnell holds a finance/accounting qualification with the Association of Certified Accountants from Edinburgh College, Scotland.

John D. Howard has served as a Director of VS Parent, Inc. since June 2006 and prior to that time, he served as a Director of VS Holdings, Inc. since 2002. He is currently a Senior Managing Director of Bear, Stearns & Co. Inc. and is the Chief Executive Officer of Bear Stearns Merchant Banking LLC, an affiliate of Bear, Stearns & Co. Inc. Mr. Howard has been the head of the merchant banking department of Bear, Stearns & Co. Inc. since its inception in 1997. From 1990 to 1997, he was a co-CEO of Vestar Capital Partners, Inc., a private investment firm specializing in management buyouts. Previously he was a Senior Vice President of Wesray Capital Corporation, a private investment firm specializing in leveraged buyouts. Mr. Howard currently serves as a director of several private companies, as a director and member of the Corporate Governance Committee of New York & Company, Inc., a publicly traded company, and as a director and lead director of the publicly traded companies Aeropostale, Inc. and Integrated Circuit Systems, Inc., respectively.

Eggebrecht has been a director of IDT since September 2005. Eggebrecht joined the IDT board of directors as part of the IDT and ICS merger and had been a director of ICS since May, 2003. Eggebrecht served as vice president and chief scientist of ICS from 1998 through May 30, 2003 and possesses more than 30 years of experience in the integrated circuit and personal computer industries. Prior to his employment with ICS, Eggebrecht was chief architect for the Multimedia Products Group at Philips Semiconductor from 1996 to 1998 and was a senior engineer at S3 in 1996. Eggebrecht also held senior engineering positions at Commodore International, Franklin Computer and IBM. Eggebrecht holds numerous patents and industry awards and has authored more than 25 articles for a variety of technical publications. Eggebrecht holds a B.S.E.E. degree from the Michigan Technological University and has accomplished advanced degree work at the University of Minnesota.

Nam P. Suh has been a director since December 2003. Mr. Suh was inaugurated as president of Korea Advanced Institute of Science and Technology (KAIST) in July 2006. In 2008, he retired from the Massachusetts Institute of Technology (MIT) where he had been a member of the faculty since 1970. At MIT, Mr. Suh held many positions including director of the MIT Laboratory for Manufacturing and Productivity, head of the department of Mechanical Engineering (1991-2001) director of the MIT Manufacturing Institute and director of the Park Center for Complex Systems. In 1984, Mr. Suh was appointed the assistant director for Engineering of the National Science Foundation by President Ronald Reagan and confirmed by the U.S. Senate. Mr. Suh is a widely published author of approximately 300 articles and seven books on topics related to tribology, manufacturing, plastics and design. Mr. Suh has approximately 50 United States patents and many foreign patents, some of which relate to plastics, polymers and design. He is the recipient of six honorary doctorates from six universities in four continents. Mr. Suh also serves on the board of directors of Integrated Device Technology, Inc., a publicly traded company.

Ronald Smith, a director of IDT since March 2004, is senior vice president at Intel Corporation. During his 26 years at Intel, Smith brings extensive, broad-based semiconductor experience to the IDT board, particularly in wireless communications and memory technology. In his active role as senior vice president and general manager of the wireless communications and computing group, he drives all business responsibilities for the company's cellular and 2.5G and 3G wireless communications products including chipsets, reference designs and software. He also managed the flash business, digital signal processing activities, Intel® XScale® Microarchitecture, StrongARM® processors and low-power Intel Architecture handhelds. Prior to this role, Smith held senior executive positions in several divisions throughout Intel including the Computing Enhancement Group, the PCI Components Division, the Programmable Logic Device Division and the Logic Technology Development Group. Smith is very active with industry organizations such as the Semiconductor Industry Association (SIA) where he most recently served as chairman of the technology strategy committee. Smith received a doctorate and a master's degree in physics from the University of Minnesota and a bachelor's degree from Gettysburg College.

Umesh Padval is a Partner at Bessemer Venture Partners’ in their Menlo Park office. He brings close to 25 years experience in marketing, sales and general management in the high tech industry. Umesh has management experience in a variety of markets, including computing, mobile communications and consumer digital entertainment. Most recently, he was Executive Vice President of the Consumer Products Group at LSI Logic. He joined LSI Logic via its acquisition of C-Cube Microsystems, a public company where he served as President and CEO. Previously, Umesh held management positions at VLSI Technology as executive vice president of its consumer and computing products groups. He began his career at Advanced Micro Devices. Umesh also has extensive global experience, having established R&D centers in China and India, beginning in the late 1990s. In addition, Umesh has served on the boards of C-Cube Microsystems, Elantec Semiconductor and Pictos Technologies. He currently serves on the boards of public companies such as Entropic Communications, IDT Corporation and Monolithic Power Systems as well as onseveral private company boards. He holds a bachelor’s degree in Technology from Indian Institute of Technology, Mumbai, and a master’s degree in Engineering from Stanford University.