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hardware and pennsylvania state university and silicon - All News and Analysis
Precision bonding joins tiny high-performance actuators.(WELDING/JOINING)
- 2005-12-01
Flat strips of bulk PZT, a commercially available piezoelectric material that shrinks slightly when a voltage is applied to it, and a precision micromachined silicon beam, have reportedly been bonded by low temperature wafer bonding techniques in a study at Pennsylvania State University, University Park. The...
Bonding process for piezoelectric microactuators.(ELECTRONICS)
- 2005-12-01
Using a novel precision bonding process, researchers at Pennsylvania State University Penn State, USA, have designed and fabricated piezoelectric microactuators. The microactuators are made from flat strips of bulk lead zirconate titanate PZT and a precision micromachined silicon beam. These were formed using...
Memory roadblock. (researchers are having difficulty finding a way toplace more random access memory onto silicon chips)(Brief Article)
- 1996-02-19
00-00-0000 FINDING A WAY TO PUT MORE AND more random access memory RAM onto silicon chips is becoming more complicated, admits Darrell G. Schlom, researcher at Pennsylvania State University, University Park. "We now know that simply putting a conducting binary oxide between silicon and...
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