<?xml version="1.0" encoding="iso-8859-1" ?>
<rss version="2.0" xmlns:s="http://resources.bnet.com/">
<channel>
	<title><![CDATA[illinois tool works Resources | BNET]]></title>
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	<description><![CDATA[White papers, case studies, business articles, and blog posts relating to illinois tool works]]></description>
	<s:counts start="0" returned="7" found="7" />
	<language>en-us</language>
	<item>
		<title><![CDATA[Earnings Preview: Illinois Tool Works]]></title>
		<link><![CDATA[http://dw.com.com/redir?destUrl=http%3A%2F%2Fseekingalpha.com%2Farticle%2F100046-earnings-preview-illinois-tool-works%3Fsource%3Dbnet&siteid=23&tag=seekingalpha]]></link>
		<description><![CDATA[Illinois Tool Works ITW is expected to report Q2 earnings before market open Thursday, October 16, with a conference call scheduled for 2:00 pm ET. Guidance Analysts are looking for EPS of 93c on revenue of $4.46B. The consensus range is 84c to 98c for EPS, and $4.14B to $4.56B...]]></description>
		<s:doctype><![CDATA[External links]]></s:doctype>
		<pubDate>Wed, 15 Oct 2008 09:52:52 -0700</pubDate>
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		<category domain="http://rss.financialcontent.com/stocksymbol">ITW</category>
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	</item>
	<item>
		<title><![CDATA[Recent Advances in Capacitor Technology With Application to High Frequency Power Electronics and Voltage Conversion]]></title>
		<link><![CDATA[http://jobfunctions.bnet.com/abstract.aspx?docid=118632]]></link>
		<description><![CDATA[This white paper informs about the High frequency switching regulators that need improved input capacitors to control common mode noise. It also tell about Electrolytic capacitors that remain essential for high current handling while electrostatic capacitors are still needed for fast response and to handle high ripple current. The adoption...]]></description>
		<s:doctype><![CDATA[White papers]]></s:doctype>
		<pubDate>Mon, 13 Mar 2000 00:00:00 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/capacitor.html"><![CDATA[Capacitor]]></category>
		<category domain="http://resources.bnet.com/topic/electronics.html"><![CDATA[Electronics]]></category>
		<category domain="http://resources.bnet.com/topic/illinois+tool+works.html"><![CDATA[Illinois Tool Works]]></category>
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		<title><![CDATA[Evaluation of SMT Polymer Film Capacitors Using Newly Developed, Low Shrinkage PET]]></title>
		<link><![CDATA[http://jobfunctions.bnet.com/abstract.aspx?docid=118635]]></link>
		<description><![CDATA[This white paper describes in detail about the advances in polymer film dielectric technology, coupled with a revolutionary processing system that has made possible high value and miniaturized electrostatic capacitors which compete favorably against ceramic and tantalum capacitors in many critical applications. It also gives an insight into thin polymer...]]></description>
		<s:doctype><![CDATA[White papers]]></s:doctype>
		<pubDate>Mon, 06 Mar 2000 00:00:00 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/capacitor.html"><![CDATA[Capacitor]]></category>
		<category domain="http://resources.bnet.com/topic/polymer.html"><![CDATA[Polymer]]></category>
		<category domain="http://resources.bnet.com/topic/illinois+tool+works.html"><![CDATA[Illinois Tool Works]]></category>
		<category domain="http://resources.bnet.com/topic/telecom+%2526+utilities.html"><![CDATA[Telecom & Utilities]]></category>
	</item>
	<item>
		<title><![CDATA[Film Chip Capacitors Save Space in High Frequency Power Trains]]></title>
		<link><![CDATA[http://jobfunctions.bnet.com/abstract.aspx?docid=118636]]></link>
		<description><![CDATA[This white paper brings out information about the combination of the recent availability of ultra thin polymer dielectrics and advances in multilayer stacking and chip packaging methods that has allowed for the production of higher voltage plastic film-chip capacitors which are suitable for surface mounting. It also reveals that the...]]></description>
		<s:doctype><![CDATA[White papers]]></s:doctype>
		<pubDate>Fri, 25 Feb 2000 00:00:00 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/capacitor.html"><![CDATA[Capacitor]]></category>
		<category domain="http://resources.bnet.com/topic/chip.html"><![CDATA[Chip]]></category>
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	<item>
		<title><![CDATA[Multilayer Polymer (MLP) Capacitors Provide Low ESR and Are Stable Over Wide Temperature and Voltage Ranges]]></title>
		<link><![CDATA[http://jobfunctions.bnet.com/abstract.aspx?docid=118637]]></link>
		<description><![CDATA[This white paper basically reveals about the proven capacitor technology which has been built upon the best of the manufacturing techniques of multilayer ceramic and stacked plastic film capacitors. It signifies the film capacitor reliability that can be found in chip and block shaped capacitors that approach the board space...]]></description>
		<s:doctype><![CDATA[White papers]]></s:doctype>
		<pubDate>Fri, 25 Feb 2000 00:00:00 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/capacitor.html"><![CDATA[Capacitor]]></category>
		<category domain="http://resources.bnet.com/topic/polymer.html"><![CDATA[Polymer]]></category>
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		<category domain="http://resources.bnet.com/topic/telecom+%2526+utilities.html"><![CDATA[Telecom & Utilities]]></category>
	</item>
	<item>
		<title><![CDATA[Requirement for Robust Capacitors in High Density Power Converters]]></title>
		<link><![CDATA[http://jobfunctions.bnet.com/abstract.aspx?docid=118633]]></link>
		<description><![CDATA[The white paper describes about the Power supply designers that are faced with complex component size and part shape issues in order to minimize circuit board land area and maximize cubic space efficiency. Chip capacitors are perhaps the most fragile components in the power system, being easily damaged by external...]]></description>
		<s:doctype><![CDATA[White papers]]></s:doctype>
		<pubDate>Tue, 25 Jan 2000 00:00:00 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/circuit+board.html"><![CDATA[Circuit Board]]></category>
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	</item>
	<item>
		<title><![CDATA[Board Flexure Comparison between Surface Mount Multi-Layer Ceramic and Film Capacitors]]></title>
		<link><![CDATA[http://jobfunctions.bnet.com/abstract.aspx?docid=118634]]></link>
		<description><![CDATA[This paper discusses about the Surface mount production techniques that are the standard in electronics manufacturing; components are now subjected to mechanical stresses during both assembly and use. Flexure or printed wiring board PWB bending is a significant source of these stresses that can lead to component breakage and failure....]]></description>
		<s:doctype><![CDATA[White papers]]></s:doctype>
		<pubDate>Tue, 25 Jan 2000 00:00:00 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/board.html"><![CDATA[Board]]></category>
		<category domain="http://resources.bnet.com/topic/capacitor.html"><![CDATA[Capacitor]]></category>
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</channel>
</rss>
