BNET Industries
Last Fiscal Year Sales:$75.0M
- Private
- US
Dow Jones Description
Northrop Grumman Interconnect Technologies Division(NGITD) is a world-leading supplier of high-performance daughtercard, midplane and backplane solutions to major blue-chip customers in markets as diverse as network and wireless infrastructure, defense and electronic data processing. With over 40 years experience in manufacturing some of the largest, thickest and most complex printed circuit boards in the world, we have established an international reputation for our core PCB fabrication technologies. Building upon our core PCB fabrication base, to maximize value for our customers, we have invested in process and signal integrity research & development to provide a range of elegant technology solutions to meet the challenging interconnect needs of next generation advanced electronic systems.
President
Robert SchutzNumber of Employees 749
Peer Companies
NAICS Code Bare Printed Circuit Board Manufacturing: 334412
News & Analysis
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interconnect technologies - All News and Analysis
Flex Interconnect Technologies
- 2009-05-01
[ILLUSTRATION OMITTED] Flex Interconnect Technologies FIT has named Raj Badoni director of sales and marketing. He brings over 13 years of experience in the semiconductor industry, specializing in technology development, manufacturing, yield management and capital equipment applications and marketing.
Mellanox Interconnect Technologies Drive Performance and Scalability for HP Oracle Database Machine Customers
- 2008-09-25
Mellanox InfiniBand Adapter and Switch Solutions are Embedded in the HP Oracle Database Machine to Help Deliver Faster Business Intelligence and Higher Levels of Competitiveness for Fortune 500 Companies SANTA CLARA, Calif. & YOKNEAM, Israel -- Mellanox[R] Technologies, Ltd. (NASDAQ:MLNX)(TASE:MLNX), a leading supplier of semiconductor-based server and storage interconnect...
Technologists Assess 3D Interconnect Technologies and Equipment Readiness at SEMATECH Workshop during SEMICON West
- 2008-07-22
ALBANY, N.Y. -- A host of industry experts involved in the development and implementation of 3D interconnect technology gathered at a SEMATECH-led workshop to explore equipment challenges for 3D interconnect, comparing application requirements to those proposed by the International Technology Roadmap for Semiconductors ITRS. The workshop entitled "Equipment Challenges...
Flex Interconnect Technologies'
- 2008-06-01
Flex Interconnect Technologies'. (fit-4flex.com) quality management system has been certified to AS9100 revision B standards. The audit was conducted by Intertek Systems.
High-Speed Interconnect Design Seminar Explores Trends and Challenges for PCI Express, RapidIO, 10Gbps Ethernet, DisplayPort, HyperTransport, and Other Interconnect Technologies
- 2008-05-01
The Linley Group, the leading provider of independent technology analysis for networking, communications, and consumer electronics semiconductors, is sponsoring a free* Linley Tech Seminar on High-Speed Interconnect Design to be held May 14th in San Jose, Calif. It will explore industry trends and spotlight specific challenges in applying current and...
New Report Examines Potential Interconnect Technologies And Solutions And Make Recommendations To Industry And Government On How To Accelerate Commercialization
- 2007-11-26
DUBLIN, Ireland -- Research and Markets (http://www.researchandmarkets.com/reports/c75346) has announced the addition of "Optical Interconnects: "Thinking Inside of the Box"" to their offering. Examines potential interconnect technologies and solutions and make recommendations to industry and government on how to accelerate commercialization. The potential advantages of optical interconnects for board-to-board,...
RMI's Processor Families Provide the Ultimate in Acceleration through Advanced Interconnect Technologies
- 2007-09-18
Raza Microelectronics, Inc. Supports Intel Geneseo and QuickAssist Technology Initiatives Extending Performance in Next Generation Products SAN FRANCISCO -- Raza Microelectronics, Inc. (RMI([R])), a leading supplier of processors for communications and consumer applications announced today that RMI will support the broad market attach strategy of Intel Corporation that involves...
European Printed Circuit Board Automatic Test Equipment Market: Demand For Advanced Packaging And Interconnect Technologies Is Likely To Intensify
- 2006-11-28
DUBLIN, Ireland -- Research and Markets (http://www.researchandmarkets.com/reports/c46144) has announced the addition of European Printed Circuit Board Automatic Test Equipment Markets to their offering. This Frost & Sullivan research service titled European Printed Circuit Board Automatic Test Equipment Markets provides an overview of PCB testers such as in-circuit testers ICT,...
Advanced Interconnect Technologies Signs Multi-Year Assembly Services Agreement With IDT and Will Purchase Assets From the IDT Malaysia-Based Assembly Operations
- 2006-10-10
AIT To Provide Additional Assembly Services to IDT; Malaysian Assembly Operations to Be Gradually Moved to Batam, Indonesia
Northrop Grumman Interconnect Technologies Selects Cimnet Systems to Streamline Its Business Processes, Support Its Growth Strategy
- 2006-08-29
INDIANAPOLIS -- Suite of ERP Solutions Preferred for Proven Ability to Increase Efficiency, Reduce Costs, Minimize Inventories, and Improve Customer Satisfaction
Decision Makers
| Name (plus bio) | Position |
|---|---|
| Robert Schutz | President |
| Organization | Position | Status |
|---|---|---|
| Interconnect Technologies | President | Current |
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Industry Transcripts by Seeking Alpha
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Comtech Telecommunications Corp. F1Q10 (Qtr End 10/31/09) Earnings Call Transcript
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