BNET Industries
Last Fiscal Year Sales:$30.0M
- Private
- US
Dow Jones Description
Mfr. of Semiconductor Equipment
Number of Employees 75
Peer Companies
NAICS Code Other Electronic Component Manufacturing: 334419
News & Analysis
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palomar technologies inc. - All News and Analysis
Palomar Technologies to Exhibit at Semicon West 2009 Booth #621
Palomar Technologies, a world leader in providing solutions for microelectronics and optoelectronic packaging , and experts in precision wire bonding , complex hybrid packaging, and high accuracy die bonding systems, announced today that it will exhibit at Semicon West in San Francisco from...
Palomar Technologies at European Microelectronics and Packaging Conference 2009
Palomar Technologies , a world leader in providing solutions for microelectronic and optoelectronic packaging , and experts in precision wire bonding , complex hybrid packaging, and high accuracy die bonding systems, announced today that it will participate at the European Microelectronics and Packaging Conference 2009...
Palomar Technologies to Exhibit Advanced Microelectronics Solutions at 2009 ECTC Conference
Palomar Technologies, a world leader in the manufacturing of microelectronic and optoelectronic packaging, announced today it will again be exhibiting at the 2009 Electronic Components and Technology Conference in San Diego on May 26, 27 and 28. Experts will be on hand to explain how Palomar's wire...
Wire Bonding Company Palomar Technologies to Exhibit at 2009 SMT Nuremberg
Palomar Technologies , a world leader in providing solutions for microelectronic and optoelectronic packaging , and experts in precision wire bonding , gold wire bonding, and high accuracy component placement systems, announced today that it will exhibit at SMT Nuremberg from May 5 through 7....
Wire Bonding Company, Palomar Technologies, Forms Alliances With GPD Global, Royce Instruments and Hybond
Palomar Technologies , a world leader in providing solutions for microelectronic and optoelectronic packaging and experts in precision wire bonding , gold wire bond and high accuracy component placement systems, announced today it has formed alliances with GPD Global, Hybond, Inc., and Royce...
Palomar Technologies Launches Wafer Scale Die Attach System at 2009 IMAPS Device Packaging Conference
Palomar Technologies announced today it will be launching its new Wafer Scale Die Attach System at the 2009 IMAPS International Conference and Exhibition on Device Packaging, to be held March 10-12 in Scottsdale, Arizona. Palomar Technologies will be exhibiting in booth #15 at the IMAPS Conference. Palomar's bonding experts...
Palomar Technologies Launches Wafer Scale Die Attach System at 2009 IMAPS Device Packaging Conference
Palomar?s Bonding Experts Will Be on Hand to Explain Microelectronic Die Attach Solutions, High Accuracy Wire Bonding and More ...
Palomar Technologies to Exhibit at 2009 Strategies in Light Exhibition and Conference
Palomar Microelectronics Experts Will Be on Hand to Explain Wire Bonding, Wafer Scale Packaging and More CARLSBAD, Calif. -- Palomar Technologies announced today it will return to exhibit at the 2009 Strategies in Light Exhibition and Conference to be held February 18 - 20, 2009 in Santa Clara, California....
Palomar Technologies to Exhibit at 2009 Strategies in Light Exhibition and Conference
Palomar Technologies announced today it will return to exhibit at the 2009 Strategies in Light Exhibition and Conference to be held February 18 - 20, 2009 in Santa Clara, California. Palomar Technologies will be exhibiting in booth #606 at the Strategies in Light Exhibition and Conference where microelectronics...
Palomar Technologies Posts Best Year of the Millennium and Upgrades Organization
CARLSBAD, Calif. -- Palomar Technologies, provider of automated precision microelectronic assembly equipment and contract assembly services, announced today it has posted its best year since 2000. "We exceeded our sales, booking and profit targets in 2008 and are carrying a strong backlog into the current year," said Bruce W....
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