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	<title><![CDATA[semiconductor and silicon wafer Resources | BNET]]></title>
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	<description><![CDATA[White papers, case studies, business articles, and blog posts relating to semiconductor and silicon wafer]]></description>
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		<title><![CDATA[Waste into energy: IBM repurposes millions of discarded silicon wafers.(Front Line)(International Business Machines Corp.'s a semiconductor wafer reclamation process )]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_hb6606/is_200801/ai_n26030861]]></link>
		<description><![CDATA[IBM announced a semiconductor wafer reclamation process pioneered  at its Burlington, Vt., manufacturing facility. The new process uses a  specialized pattern removal technique to repurpose scrap semiconductor  wafers--thin discs of silicon material use  IBM announced a semiconductor wafer reclamation process pioneered  at its Burlington, Vt.,...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Tue, 01 Jan 2008 00:00:00 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/ibm+corp..html"><![CDATA[IBM Corp.]]></category>
		<category domain="http://resources.bnet.com/topic/semiconductor.html"><![CDATA[semiconductor]]></category>
		<category domain="http://resources.bnet.com/topic/silicon+wafer.html"><![CDATA[silicon wafer]]></category>
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		<category domain="http://rss.financialcontent.com/stocksymbol">IBM</category>
		<category domain="tickers">IBM</category>
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		<title><![CDATA[Tiny Asian nations home to giant new chip plants. (Project Wire).(Brief Article)]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_hb5673/is_200207/ai_n23712348]]></link>
		<description><![CDATA[Two of the world's largest contract chip manufacturers are  moving ahead with plans to build next-generation semiconductor plants in  Taiwan and Singapore. Taiwan Semiconductor Manufacturing TSMCis  breaking ground on two fabs, one in North Taiwan's H  Two of the world's largest contract chip manufacturers are ...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Mon, 01 Jul 2002 00:00:00 -0700</pubDate>
		<category domain="http://resources.bnet.com/topic/chip.html"><![CDATA[chip]]></category>
		<category domain="http://resources.bnet.com/topic/semiconductor.html"><![CDATA[semiconductor]]></category>
		<category domain="http://resources.bnet.com/topic/silicon+wafer.html"><![CDATA[silicon wafer]]></category>
		<category domain="http://resources.bnet.com/topic/taiwan+semiconductor+manufacturing+co.+ltd..html"><![CDATA[Taiwan Semiconductor Manufacturing Co. Ltd.]]></category>
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		<category domain="http://rss.financialcontent.com/stocksymbol">TSM</category>
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		<title><![CDATA[SEMICONDUCTORS: SEMI Reports on Q1 Wafer Shipments. ]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_go2661/is_200206/ai_n7019514]]></link>
		<description><![CDATA[Semiconductor Equipment and Materials International (SEMI, 3081 Zanker Rd., San Jose, CA 95134; Tel: 408/943-7987) reports in its recent analysis of the silicon wafer industry, that, compared to the fourth quarter of 2001, worldwide silicon wafer area shi      Semiconductor Equipment and Materials International (SEMI, 3081...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Sat, 01 Jun 2002 00:00:00 -0700</pubDate>
		<category domain="http://resources.bnet.com/topic/semiconductor.html"><![CDATA[semiconductor]]></category>
		<category domain="http://resources.bnet.com/topic/semiconductor+equipment+and+materials+international.html"><![CDATA[Semiconductor Equipment and Materials International]]></category>
		<category domain="http://resources.bnet.com/topic/silicon+wafer.html"><![CDATA[silicon wafer]]></category>
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		<title><![CDATA[Infineon Selects Agilent Technologies' Semiconductor Parametric Test Systems for Testing of Silicon Wafers Used in Memory Devices]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_m0EIN/is_2002_Jan_8/ai_81471966]]></link>
		<description><![CDATA[Business Editors/High-Tech Writers]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Tue, 08 Jan 2002 00:00:00 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/agilent+technologies+inc..html"><![CDATA[Agilent Technologies Inc.]]></category>
		<category domain="http://resources.bnet.com/topic/infineon+technologies+ag.html"><![CDATA[Infineon Technologies AG]]></category>
		<category domain="http://resources.bnet.com/topic/semiconductor.html"><![CDATA[semiconductor]]></category>
		<category domain="http://resources.bnet.com/topic/silicon+wafer.html"><![CDATA[silicon wafer]]></category>
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		<category domain="http://rss.financialcontent.com/stocksymbol">A</category>
		<category domain="http://rss.financialcontent.com/stocksymbol">IFX</category>
		<category domain="tickers">A,IFX</category>
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		<title><![CDATA[SEMI taps 3 for 300mm effort - Executives Murray Bullis, George Lee and Ronald S. Horwath to lead Semiconductor Equipment & Materials International 300mm silicon wafer effort - Industry Trend or Event]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_m0EKF/is_n2100_v42/ai_17855879]]></link>
		<description><![CDATA[Mountain View, Calif.--Semiconductor Equipment & Materials International SEMI last week named three new executives who will help guide the organization's efforts in making 300-millimeter (12-inch) silicon wafers a reality for the semiconductor industry.]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Mon, 22 Jan 1996 00:00:00 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/silicon+wafer.html"><![CDATA[silicon wafer]]></category>
		<category domain="http://resources.bnet.com/topic/semiconductor+equipment+and+materials+international.html"><![CDATA[Semiconductor Equipment and Materials International]]></category>
		<category domain="http://resources.bnet.com/topic/semiconductor.html"><![CDATA[semiconductor]]></category>
		<category domain="http://resources.bnet.com/topic/semiconductor+equipment.html"><![CDATA[Semiconductor Equipment]]></category>
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