Spansion Inc.

John H. Kispert, CEO, joined Spansion with 15 years experience in the semiconductor industry, with a broad-based background spanning executive, financial and operational roles. Most recently, Kispert spent 13 years in a number of finance and operational roles at KLA-Tencor including President, Chief Operations Officer and Chief Financial Officer. During his tenure at KLA-Tencor, a leading semiconductor equipment company with more than $2.5 billion in revenue and a global workforce of more than 6,000 employees, Kispert played an instrumental role in several of the company's most critical initiatives including operational and organizational restructuring following the 1997 merger between KLA Instruments and Tencor Instruments. Kispert also held various executive management positions at KLA-Tencor including Vice President of Operations with responsibility for customer service and support, manufacturing, and sales operations. Prior to KLA-Tencor Kispert held several senior management positions with IBM. Kispert received his Bachelor's degree in Political Science from Grinnell College and his MBA from the University of California, Los Angeles.

Masao Taguchi is president of Spansion Japan Limited, executive vice president and chief scientist of Spansion. As Spansion Japan’s president, he is responsible for leading the Japan team and playing an active role with our customers and other external constituents. As chief scientist, Taguchi is charged with driving the worldwide development of advanced memory technology. Honored as one of the original inventors of Pseudo SRAM for cellular phones, Taguchi brings 30 years of high-level technical experience in semiconductor product design, development, and patent issues to his role at Spansion. Taguchi has driven tremendous breakthroughs in process technology and memory design. He holds over 284 collective patents in the U.S., Japan, and other countries. His advancements established Fujitsu as a pioneer and early leader in the PSRAM market and affected a significant shift in industry growth and direction. His product innovations also generated new markets and business opportunities, and secured intellectual property rights for both Fujitsu and Spansion. Taguchi began his industrious career at Fujitsu in 1976 as a research staff in the company’s Semiconductor Devices Laboratory. His career took off and he went on to hold numerous management positions within the company including chief research staff, director of Fujitsu’s Product Development Division within its Electron Devices Group, deputy general manager of the company’s DRAM Division and general manager of the Fujitsu’s System Memory Division. Following his promotion to general manager of System Memory, Taguchi joined the core team responsible for Spansion’s reorganization in cooperation with AMD, and served as corporate vice president and chief marketing officer and later as executive vice president and chief scientist. Taguchi holds bachelor’s, master’s and doctorate degrees in electronic engineering from the Tokyo Institute of Technology in Tokyo, Japan.

Eduardo Maayan is President of Saifun. Maayan brings more than 20 years of design, product development and memory expertise and serves as president of Saifun Semiconductors, a wholly owned subsidiary of Spansion. Previously at Saifun, Maayan served as executive vice president of business development and executive vice president of research & development. Prior to joining Saifun, Maayan worked at Intel’s design center in Haifa, where he lead the Global Circuit team in the microprocessor department and was involved in the design of digital and analog integrated circuits, the definition of design methodologies, and the development of CAD tools. Prior to Intel, he carried out research on “Selective Epitaxial MOCVD Growth for Optoelectronic Integrated Devices” at the Microelectronics Center of the Technion – Israel Institute of Technology. He also serves as a lecturer at the Technion’s Electrical Engineering faculty. Eduardo holds a B.Sc. and M.Sc. in Electrical Engineering from the Technion – Israel Institute of Technology. He holds 30 issued U.S. patents and several pending U.S. patent applications.

Ahmed Nawaz is executive vice president of Spansion’s Wireless Solutions Division and is responsible for expanding Spansion’s growth for this division. He also oversees the division’s marketing, platform engineering, infrastructure development and program management functions. He brings 30 years in high-tech, including more than 17 years as an executive to the position. Prior to Spansion®, Nawaz was executive vice president of worldwide sales at Agere Systems. Prior to this, he was president of the integrated circuits division of Lucent's Microelectronics Group, with full responsibility for the company's $2.5 billion IC business. At Lucent, he also led the profitable Wireless, Network Communications, Computing and the Access business units, and global manufacturing operations and was also vice president of marketing and strategy where he was responsible for formulating and driving an applications-focused strategic direction for the Microelectronics Group. Additionally, Nawaz spent 14 years at Texas Instruments, where he held various engineering, applications, marketing and general management positions. He has been a speaker and panelist at many industry conferences, including, SIGGRAPH, NCGA, MicroSystems Forum, and other PC, wireless and communication conferences, and is a member of the board of directors of Digi International. Nawaz holds a master's degree in Electrical Engineering from the University of Missouri and a master's degree in Business Administration from Houston Baptist University.

Ajit Manocha is Spansion’s executive vice president for worldwide operations. He is responsible for all aspects of the company’s global manufacturing operations, IT and supply chain management, including product cost, yields, quality, reliability, on-time delivery, manufacturing cycle times and customer service. With more than 28 years of global expertise in R&D, manufacturing, M&A, sales and general management, Manocha brings diverse management experience to Spansion. A seasoned semiconductor expert, Ajit has held several senior executive and management positions at NXP, Philips Semiconductors, AT&T Microelectronics and AT&T Bell Laboratories. Most recently, he was executive vice president and chief manufacturing officer at NXP (formerly Philips Semiconductors), where he was responsible for heading up worldwide IC manufacturing, supply chain management and purchasing for the semiconductor division. At Philips Semiconductors, Manocha made significant improvements in that company’s supply chain and was responsible for leading the manufacturing operations to world-class operational and financial performance. While at AT&T Microelectronics, Manocha was charged with developing new joint ventures and strategic alliances, and he played a lead role in the manufacturing JV of AT&T and Cirrus Logic. While at NXP, Manocha has most recently been a member of the Board of Directors of International Semitech, the Crolles Alliance (a 300mm development and manufacturing joint venture between STM, Freescale and Phillips), ASMC (a publicly traded foundry in China) and chairman of the BoD of SSMC (a joint venture between NXP and TSMC).

Ali Pourkeramati is executive vice president, Applications and Platform Engineering, at Spansion, responsible for Application, Systems and Software Engineering, Platform Development, and New Product Quality. Previously, Pourkeramati was corporate vice president of Platform Design, responsible for design engineering and new product quality at Spansion. Pourkeramati also served as vice president of Engineering at Spansion, where he introduced several new methodologies to the company, including the microcontroller and platform product design. Pourkeramati brings more than 24 years in the non-volatile memory industry to Spansion, having received a number of prestigious recognitions for his work, including more than a dozen patents and several publications in non-volatile memory, architecture, design and Complex Programmable Logic Device (PLD). Prior to Spansion in 2004, Pourkeramati was founder, president and CEO of Azalea Microelectronics Corp., where he worked for nine years, licensing the company's Flash technology to OEMs in the embedded and consumer markets. Additionally, Pourkeramati held manager, director and vice president level engineering positions at International CMOS Technology, Inc., ICT and Signetics Corporation where he spearheaded a number of non-volatile memory innovations. At Signetics, he was responsible for designing the first NMOS 64K memory. At International CMOS and ICT, he pioneered simple PLD and Complex PLD, based on non-volatile memory. Pourkeramati holds a masters degree in electrical engineering from Santa Clara University and a bachelor's in electrical and computer engineering from Oregon State University.

Carla Golla is executive vice president of the Security and Advanced Technology Division and is responsible for driving the strategic direction and deployment of Spansion MirrorBit® ORNAND2™ and secure memory solutions, including the company's MirrorBit® HD-SIM™ product family. In addition, Golla is charged with creating the company's advanced technology strategy for MirrorBit ORNAND2™ technology at 43nm and below. Golla brings more than 23 years of expertise in the semiconductor business to Spansion, having received extensive industry recognition for her work, including over 50 patents, co-author of several papers on a variety of Flash memory topics and is a frequent presenter at technology conferences. Prior to joining Spansion, Golla held several management and technical positions with ST Microelectronics, most recently serving as general manager of the NAND Flash and Storage Media product group, where she was responsible for spearheading the NAND activities at ST, including hardware and software design, product engineering, quality, planning, product marketing, business development, field technical support, customer service and financial control. While at ST, she was responsible for many initiatives and innovations, including strategic and designing EPROM memories and application specific memories. Golla has a master's degree in Nuclear Physics from the University of Milan, where she also holds an undergraduate degree in Physics.

Jeff Davis is Spansion's executive vice president of worldwide sales and marketing. He brings nearly 25 years of experience in sales and engineering for high-profile companies to his position. Davis has a proven ability to drive worldwide sales operations towards growth and profitability. He is currently leading the global sales and marketing effort to transition into new markets and expanded targeted areas of opportunity. Davis joined Spansion from AMD where he was corporate vice president of worldwide sales and operations for AMD's Memory Products Group. In this capacity, he orchestrated domestic and international sales efforts and saw substantial revenue growth in his unit. Davis began his career as a sales engineer at Motorola in 1982, holding several positions in sales, sales management and support operations. In 1991, Davis moved to Motorola's Phoenix Technology Center and began focusing on the development of silicon- and system-level solutions for strategic accounts, being promoted to vice president in 1993. Davis' work at Motorola effected substantial growth and profitability. In 1998, while working as vice president of worldwide sales for Motorola's Consumer Systems Group,Davis worked with a turnaround team that took the Consumer Systems Group from a significant loss to profitability in just 18 months. The following year Davis transitioned to vice president of worldwide sales for the Networking and Computing Systems Group with revenues of $2.7 billion. Davis holds a bachelor's degree in electrical engineering from Arizona State University in Tempe, Arizona.

Tom Eby is executive vice president of Spansion’s Consumer, Set-Top Box & Industrial Division (CSID), responsible for driving Spansion’s growth and profitability in the division. He oversees the division’s marketing, product and platform engineering, infrastructure development and program management functions. Eby brings over 25 years of experience in semiconductor sales, marketing, strategy and business development and general management to his role. Prior to this position, Eby was chief marketing and sales officer, responsible for driving global sales, identifying new market opportunities and associated strategic partners, leading business development, enhancing Spansion’s systems-level capabilities, and driving Spansion’s corporate marketing and communications efforts. Prior to his chief marketing and sales officer role, Eby was Spansion’s executive vice president responsible for integrating the former AMD and Fujitsu assets that were contributed to form Spansion LLC. Before his Spansion roles, Eby worked in numerous capacities at AMD, including group vice president of strategy and business development, group vice president of the Communication Group, and a variety of sales and marketing positions in the U.S. and Europe. Eby holds a bachelor's degree in electrical engineering and computer science from Princeton University.

Lisa Guadagna is Spansion’s vice president of human resources. She brings more than 20 years of executive experience in the high-technology industry to the company. At Spansion, Guadagna is responsible for overseeing all aspects of human resources globally including business consultation, organizational development, legal compliance and policies, workforce planning and staffing, mobility, retention and compensation. During the formation of Spansion in 2003 after it was spun-off from AMD, Guadagna implemented an independent global human resources infrastructure that established policies, processes and resources for the new company. Prior to Spansion, Guadagna was a senior human resources manager at AMD for six years, where she lead the global human resources functions in support of Final Manufacturing operations in China, Malaysia and Thailand. In addition, Guadagna has held senior human resources management positions at Atmel Corporation, LaPorte PLC and Fairchild. She holds a bachelor’s degree in business management from Saint Mary’s College.

David K. Chao has been a director of Spansion Inc. since 2005. Mr. Chao is a co-founder of Doll Capital Management (DCM) a venture capital firm based in the Silicon Valley and has been a managing general partner since 1996. Prior to DCM, Mr. Chao was a co-founder and member of the board of directors of Japan Communications, Inc. Before co-founding Japan Communications, Mr. Chao worked as a management consultant at McKinsey & Company in San Francisco and as a marketing manager at Apple Computer. Prior to these positions, he was an account executive for Recruit, a Japanese human resources, advertising and services company. Mr. Chao serves on the boards of numerous DCM portfolio companies, including 51job, Inc,where he has served since 2000. He is a management board member of the Stanford Graduate School of Business Board of Trustees and a member of The Thacher School Board of Trustees. Mr. Chao received a bachelor’s degree in economics and East Asian studies from Brown University and a master’s degree in business administration from Stanford University.

Gilles Delfassy is responsible for Texas Instruments Incorporated's semiconductor activities in the wireless terminals market, including strategy, new products and programs, development and key customer relationships. He has led TI's wireless effort since 1994. Mr. Delfassy has been with TI since 1978. Before his current position in Dallas, Texas, he served as TI's European Digital Signal Processing (DSP) Department Manager from 1989 to 1994. Previously, he was a product line manager in TI's Microprocessor and Microcontroller Division of the Semiconductor Group. He also has experience in semiconductor systems sales. Mr. Delfassy graduated from the "Institut d'Administration des Entreprises de Paris" in 1978. In 1977 he received an Engineer Diploma in Electrical Engineering from "Ecole Nationale Superieure d'Ingenieurs de Toulouse".

John M. Stich has been a director since December 2006. He is the Honorary Consul General of Japan at Dallas. Previously, he spent 35 years at Texas Instruments, with his most recent position as chief marketing officer in Japan. He lived and worked for Texas Instruments in Asia for a total of 24 years where he held various additional management positions such as vice president of semiconductors for Texas Instruments Asia Ltd., managing director of Texas Instruments Hong Kong Ltd., and marketing director of Texas Instruments Taiwan Limited. Mr. Stich has been active in leading various industry associations, including serving as: governor of the American Chambers of Commerce in Japan and Hong Kong, and chairman of the Semiconductor Industry Association (Japan Chapter). Currently, he is a director of Stonestreet One, Inc., a leading provider of short-range wireless solutions, and Diodes Incorporated, a leading manufacturer and supplier of high-quality discrete and analog semiconductors. In addition, he is a member of the Dallas/Taipei Sister City Committee, a member of the Advisory Council for Southern Methodist University's Asian Studies Program, a director of the Japan America Society of Dallas/Fort Worth, vice dean of the Consular Corps of Dallas/Fort Worth and a member of the Pastoral Council of Prince of Peace church. Mr. Stich holds a bachelor's degree in electrical engineering from Marquette University.