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dram and sram

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Need for Smaller, High-speed, Ultra-high Density, Storage Devices Fostering Advances in Embedded Memories.: M2 PRESSWIRE-29 May 2007-Research and Markets: Need for Smaller, High-speed, Ultra-high Density, Storage Devices Fostering Advances in Embedded MemoriesC1994-2007 M2 COMMUNICATIONS LTD RDATE:29052007 Dublin: Research and Markets (http://www.researchandmarkets.com/reports/c58260) has announced the addition of the Frost & Sullivan report: Advances in...; Tags: Components, DRAM, Frost & Sullivan, HARDWARE, Memory, RAM, Semiconductors, SRAM, storage; Research articles 2007-05-29
Innovative Silicon Inc. Selected by Embedded Systems Conference for New "Disruption Zone": Z-RAM([R]) Memory Technology to be Recognized at IEEE Spectrum "Winning Technology" Luncheon and EE Times' ACE Awards Gala SANTA CLARA, Calif. -- Innovative Silicon ISi, the developer of Z-RAM high-density memory intellectual property IP, announced today that it has been selected to exhibit in the Disruptive Zone in booth...; Tags: Components, DRAM, HARDWARE, IEEE, Memory, Semiconductors, silicon, SRAM, Technology; Research articles 2007-03-21
Review and future prospects of low-voltage RAM circuits: This paper describes low-voltage random-access memory RAM cells and peripheral circuits for standalone and embedded RAMs, focusing on stable operation and reduced subthreshold current in standby and active modes. First, technology trends in low-voltage dynamic RAMs DRAMs and static RAMs SRAMs are reviewed and the challenges of low-voltage RAMs in...; Tags: cell, CMOS, Components, Delta, DRAM, HARDWARE, IEEE, Memory, RAM, Semiconductors, SRAM, substrate, VLSI; Research articles 2003-09-01
Rising SRAM adn DRAM pricing good for ALSC, CY, MU.: M2 PRESSWIRE-27 June 2000-TheCoveredCall.com: Rising SRAM adn DRAM pricing good for ALSC, CY, MU C1994-2000 M2 COMMUNICATIONS LTD RDATE:27062000 Visit http://www.thecoveredcall.com. TheCoveredCall.com is a leading on-line investment newsletter that helps educate investors on how to pick winning stocks...; Tags: Components, DRAM, FINANCE, HARDWARE, Investment, investor, MARKETING, Memory, Nasdaq Stock Market Inc., Pricing, Semiconductors, SRAM, stock; Research articles 2000-06-27
Alliance Semiconductor Names Brad Perkins as Vice President and General Counsel: SAN JOSE, Calif.--BUSINESS WIRE--Jan. 21, 1999--Alliance Semiconductor Corporation (Nasdaq: ALSC) today announced that Brad Perkins has joined the company as Vice President and General Counsel. Prior to joining Alliance, Mr. Perkins tenure was with Mission West Properties, Inc., as Vice President and General Counsel. "I am very pleased to...; Tags: alliance, Business Wire, Components, DRAM, HARDWARE, Memory, Semiconductors, SRAM, Strategy; Research articles 1999-01-21

Alliance Semiconductor Reports Financial Results for the Quarter Ended September 26, 1998: SAN JOSE, Calif.--BUSINESS WIRE--Oct. 20, 1998--Alliance Semiconductor Corporation (Nasdaq:ALSC) today reports net revenues of $10.5 million and net loss of $5.9 million, or $0.14 per share for the second quarter of fiscal year 1999 ended September 26, 1998. The net loss includes a pre-tax charge of $2.9 million to...; Tags: alliance, Business Wire, Company, Components, DRAM, equity, FINANCE, HARDWARE, income, Memory, revenue, Semiconductors, SRAM, USC; Research articles 1998-10-20
THe circuit: Hot on the heels of Lattice Semiconductor's 1,000 macrocell introduction last week, Philips Semiconductors will today roll out what it claims is the first 960 macrocell complex programmable logic device CPLD shipping and in volume production on the market. The CoolRunner 960 device is a 3-volt device with typical propagation...; Tags: AMR Research, ASICs, chip, Components, DRAM, HARDWARE, MARKETING, Memory, Mitsubishi Corp., Modems, NEC Corp., Philips Electronics N.V., Semiconductors, SRAM, video; Research articles 1998-09-14
Alliance Semiconductor Expects Disappointing Quarter: SAN JOSE, Calif.--BUSINESS WIRE--Oct. 6, 1997--Alliance Semiconductor Corp. (NASDAQ:ALSC) today reported that primarily due to DRAM pricing declines and slower SRAM demand, it expects its revenues to be below expectations for the second fiscal quarter ended Sept. 27, 1997. The company expects net revenues to be between...; Tags: alliance, Business Wire, Components, DRAM, HARDWARE, Memory, revenue, Semiconductors, SRAM, Strategy; Research articles 1997-10-06
Out with the old, in with the new: here's a report on changing semiconductor technology as buyers ramp up their roles on product design and development teams. (Component Obsolescence).: There's no doubt that cell phone makers are in the driver's seat when it comes to demanding higher density and higher performance semiconductors. With increasingly more features and functions ranging from color displays to onboard cameras, cell pho There's no doubt that cell phone...; Tags: DRAM, Lucent Technologies Inc., performance, product design, semiconductor, SRAM, supplier, technology; Research articles 2003-03-20
SRAM surrogate supports nonstandard interface.(Toshiba's TC-51W3216)(Product Announcement): ALTHOUGH COMPANIES such as Infineon, Micron, and Mitsubishi promote low-power DRAMs that compete with more costly SRAMs, a few manufacturers have taken the next step and wrapped an SRAM-like interface and pinout around a DRAM core. MoSys was the fi ALTHOUGH COMPANIES such as...; Tags: DRAM, Fujitsu Ltd., SRAM, Toshiba Corp.; Research articles 2001-06-21
Hyundai Introduces a Potential Cost Saving Circuit for DRAMs and SRAMs: Business Editors &High Tech Writers; Tags: cost savings, DRAM, Hyundai, SRAM; Research articles 2000-02-17
Pentium ramp to fuel certain firms - increased production of Intel's Pentium microprocessor may boost profits for DRAM, SRAM and systems logic chipset companies: NEW YORK--Intel's aggressive ramp of silicon-rich Pentium microprocessors may propel the nets of more companies than Instel, according to Mark Edelstone of Prudential Securities, who suggested that a number of DRAM, SRAM and systems logic chipset makers are in line to benefit from the onslaught.; Tags: DRAM, Intel Corp., Intel Pentium, microprocessor, SRAM; Research articles 1994-02-14

Additional Resources

Complete line of copper leadframe memories introduced by ISSI: TELECOMWORLDWIRE-12 November 2008-Complete line of copper leadframe memories introduced by ISSIC1994-2008 M2 COMMUNICATIONS LTD http://www.m2.com Integrated Silicon Solution Inc ISSI (Nasdaq:ISSI), a fabless semiconductor company that designs and markets high performance integrated circuits, announced on Tuesday (11 November) the launch of a complete line of copper leadframe memories...; Articles 2008-11-12
ISSI Announces SRAM, DRAM, and EEPROM Memory with Copper Leadframes for Automotive and Industrial Applications: Copper Leadframe Enhances Reliability over Standard Leadframes MUNICH, Germany, Nov. 11 /PRNewswire-FirstCall/ -- Integrated Silicon Solution, Inc. , a leader in advanced memory solutions, today announced a complete line of copper leadframe memories including SRAM, DRAM and EEPROM devices. The use of copper leadframes enhances the long-term...; Articles 2008-11-11
New 0.3 mm Pitch RF and Test & Burn-in Sockets for Devices Up to 6.5 mm Squared Available from Aries Electronics: BRISTOL, Pa., Nov. 7 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers its high frequency Center Probe and CSP/MicroBGA test and burn-in sockets in sizes up to 6.5 mm squared with pitches down to 0.3 mm. The reduced socket pitch...; Articles 2008-11-07
MoSys ® 1T-SRAM® Embedded Memory Technology Meets TSMC 90 Nanometer eDRAM Process Standards: SUNNYVALE, Calif., Oct. 28 /PRNewswire-FirstCall/ -- MoSys, Inc. , a leading provider of high-density system-on-chip SoC memory and analog/mixed-signal intellectual property IP, today announced it has achieved Level III and IV verification of its 1T-SRAM embedded memory technology on TSMC's 90 nanometer nm General Purpose eDRAM process by the...; Articles 2008-10-28
Aries Electronics' New 6.5 mm Center Probe Test Socket Features Versatile Design Ideal for Test and Burn-In: BRISTOL, Pa., Oct. 7 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a new high-frequency center probe test socket comprised of a standard molded format that enables the socket to accommodate any device 6.5 mm or smaller. With the new...; Articles 2008-10-07
Examine the Phase Change Memory Market: Reportlinker.com announces that a new market research report related to the Components and Semiconductors industry is available in its catalogue. Phase Change Memory Enters a New Phase http://www.reportlinker.com/p095632/Phase-Change-Memory-Enters-a-New-Phase.html Phase Change Memory Enters a New Phase outlines the challenges phase change memory faces as it vies to...; Articles 2008-10-06
Aries Electronics' New Test and Burn-In and RF Sockets Now Accommodate Pitches Down to 0.3 mm: BRISTOL, Pa., Sept. 5 /PRNewswire/ -- Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has recently updated its CSP/BGA test and burn-in and RF sockets, including 13 mm squared, 27 mm squared, 40 mm squared and 55 mm squared models, to accommodate devices with pitches...; Articles 2008-09-05
UMC's Embedded DRAM, URAM Proven in 65nm Customer Silicon: Pure-Play Foundry Industry's Only Proprietary Embedded DRAM Solution Enables Performance, Size and Cost Advantages for SoC Products HSINCHU, Taiwan -- UMC (NYSE:UMC)(TSE:2303), a leading global semiconductor foundry, today announced that it has produced functional 65nm customer products incorporating URAM, the company's patented embedded DRAM eDRAM technology. URAM enables...; Articles 2008-08-04

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