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	<title><![CDATA[STATS ChipPAC Ltd. | Company News & Executive Profiles | BNET]]></title>
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	<description><![CDATA[Latest company news & analysis, recent events, stock quotes, earning call transcripts, with profiles and descriptions of top business executives for STATS ChipPAC Ltd.]]></description>
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		<title><![CDATA[STATS ChipPAC Receives Intel&#39;s Prestigious Supplier Continuous Quality Improvement Award]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_pwwi/is_200903/ai_n31400392]]></link>
		<description><![CDATA[STATS ChipPAC Ltd. has received Intel Corporation's prestigious Supplier Continuous Quality Improvement SCQI award recognizing world-class, outstanding performance in 2008. This award is Intel's highest honor for its suppliers, acknowledging extraordinary commitment to quality and exceptional performance for providing full turnkey packaging and test services deemed essential to Intel's success....]]></description>
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		<pubDate>Wed, 04 Mar 2009 23:59:59 -0800</pubDate>
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		<title><![CDATA[STATS ChipPAC Reports Fourth Quarter and Full Year 2008 Results]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_pwwi/is_200902/ai_n31319800]]></link>
		<description><![CDATA[STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced results for the fourth quarter and full year 2008.  Tan Lay Koon, President and Chief Executive Officer of STATS ChipPAC, said, "Revenue for the full year 2008 of...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Wed, 11 Feb 2009 23:59:59 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/stats+chippac+ltd..html"><![CDATA[STATS ChipPAC Ltd.]]></category>
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		<title><![CDATA[STATS ChipPAC Announces Restructuring Plan]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_pwwi/is_200812/ai_n31130761]]></link>
		<description><![CDATA[STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, today announced a restructuring plan to better align its operations with business outlook as a result of the global semiconductor downturn.  Since the middle of 2008, the Company...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Wed, 17 Dec 2008 23:59:59 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/stats+chippac+ltd..html"><![CDATA[STATS ChipPAC Ltd.]]></category>
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		<title><![CDATA[STATS ChipPAC CEO Named Asia Innovator of the Year at the CNBC Asia Business Leaders Awards]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_pwwi/is_200812/ai_n31047180]]></link>
		<description><![CDATA[STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, today announced Mr. Tan Lay Koon, President and Chief Executive Officer of STATS ChipPAC, has been named Asia Innovator of the Year at the 7th CNBC Asia Business Leaders...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Wed, 03 Dec 2008 23:59:59 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/cnbc.html"><![CDATA[CNBC]]></category>
		<category domain="http://resources.bnet.com/topic/stats+chippac+ltd..html"><![CDATA[STATS ChipPAC Ltd.]]></category>
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		<title><![CDATA[STATS ChipPAC Expands QFN Portfolio to Deliver Increased Functionality and Design Flexibility in a Thin Package Profile]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_pwwi/is_200811/ai_n31032893]]></link>
		<description><![CDATA[STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, today announced it has expanded its Quad Flat No-lead QFN packaging portfolio with a strip etch version for applications requiring increased design flexibility and higher input/output (I/O) performance in...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Mon, 24 Nov 2008 23:59:59 -0800</pubDate>
		<category domain="http://resources.bnet.com/topic/stats+chippac+ltd..html"><![CDATA[STATS ChipPAC Ltd.]]></category>
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		<title><![CDATA[STATS ChipPAC Introduces Pre-Stacked PoP Solution]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_pwwi/is_200809/ai_n28103001]]></link>
		<description><![CDATA[STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, today introduced a new Pre-Stacked Package-on-Package PoP solution that includes both a top and bottom PoP package that are assembled and tested separately, then stacked and reflowed together to...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Mon, 15 Sep 2008 23:59:59 -0700</pubDate>
		<category domain="http://resources.bnet.com/topic/stats+chippac+ltd..html"><![CDATA[STATS ChipPAC Ltd.]]></category>
		<category domain="http://resources.bnet.com/topic/.html"><![CDATA[]]></category>
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		<title><![CDATA[STATS ChipPAC Announces Manufacturing Agreement With Infineon on First Generation eWLB Technology]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_pwwi/is_200808/ai_n28035895]]></link>
		<description><![CDATA[STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, today announced it has entered into an agreement with Infineon Technologies AG (FSE/NYSE: IFX) to provide manufacturing services for products based on Infineon's first generation embedded Wafer-Level Ball Grid...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Wed, 27 Aug 2008 23:59:59 -0700</pubDate>
		<category domain="http://resources.bnet.com/topic/infineon+technologies+ag.html"><![CDATA[Infineon Technologies AG]]></category>
		<category domain="http://resources.bnet.com/topic/stats+chippac+ltd..html"><![CDATA[STATS ChipPAC Ltd.]]></category>
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		<title><![CDATA[STATS ChipPAC Offers Innovative USB Module for NAND Flash Memory Applications]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_pwwi/is_200808/ai_n28008844]]></link>
		<description><![CDATA[STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, today announced an innovative USB Universal Serial Bus module for NAND flash memory applications.  STATS ChipPAC's new USB flash drive design utilizes System-in-Package SiP and three dimensional (3D)...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Mon, 18 Aug 2008 23:59:59 -0700</pubDate>
		<category domain="http://resources.bnet.com/topic/stats+chippac+ltd..html"><![CDATA[STATS ChipPAC Ltd.]]></category>
		<category domain="http://resources.bnet.com/topic/.html"><![CDATA[]]></category>
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		<title><![CDATA[STATS ChipPAC Terminates Tender Offer and Consent Solicitation for Its Senior Notes]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_pwwi/is_200808/ai_n27992967]]></link>
		<description><![CDATA[STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, announced today that its tender offer and consent solicitation (the "Tender Offer and Consent Solicitation") in respect of its $150 million of 7.5% Senior Notes due 2010(1) and its...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Fri, 08 Aug 2008 23:59:59 -0700</pubDate>
		<category domain="http://resources.bnet.com/topic/stats+chippac+ltd..html"><![CDATA[STATS ChipPAC Ltd.]]></category>
		<category domain="http://resources.bnet.com/topic/.html"><![CDATA[]]></category>
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		<title><![CDATA[STATS ChipPAC Reports Second Quarter 2008 Results]]></title>
		<link><![CDATA[http://findarticles.com/p/articles/mi_pwwi/is_200807/ai_n27956296]]></link>
		<description><![CDATA[STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SES: S24), a leading semiconductor test and advanced packaging service provider, today announced results for the second quarter 2008.  Tan Lay Koon, President and Chief Executive Officer of STATS ChipPAC, said, "Revenue for the second quarter of 2008 of...]]></description>
		<s:doctype><![CDATA[Research articles]]></s:doctype>
		<pubDate>Tue, 29 Jul 2008 23:59:59 -0700</pubDate>
		<category domain="http://resources.bnet.com/topic/stats+chippac+ltd..html"><![CDATA[STATS ChipPAC Ltd.]]></category>
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