BNET Industries

Last Fiscal Year Sales:$17.5M
  • Private
  • US
Dow Jones Description

Founded in 1997, Tru-Si Technologies, Inc. serves the global semiconductor industry with innovative technologies for thin wafer processes and new chip-to-chip interconnection structures. Thin wafers are key in producing increasingly smaller, higher density, more functional and less costly chips used in wireless, portable, smart-card, networking and Internet applications. Tru-Si delivers solutions for damage-free wafer thinning, thin-wafer damage and stress removal, ultra-thin wafer handling, flexible integration of thin-wafer processing tools and advanced technologies focused on enabling new generations of 3D system-in-a-package (SIP) devices. In June 2001, Tru-Si introduced the industry's first flexible integration of ultra-thin wafer operations. Incorporating its NoTouchTM handling technology, this integration facilitates transfer of wafers within a tool and from tool-to-tool, resolving a major obstacle to the processing of thin wafers. To ensure that customers can use tools of their choice for thinning operations like grinding, de-taping, film frame mounting and dicing, the Company has begun to establish alliances with the manufacturers of those technologies and has initiated efforts to establish industry standards for integration-related components through major industry trade organizations. For total thinning solutions in demanding damage and stress-free applications, Tru-Si can integrate its proven ADP processing equipment to deliver cost efficient manufacturing...

Number of Employees 14
Contact Information

657 N Pastoria Ave

Sunnyvale, California 94085

www.trusi.com

1 408 720 3333

NAICS Code Semiconductor and Related Device Manufacturing: 334413

News & Analysis

tru-si technologies inc. - All News and Analysis