BNET Industries
Last Fiscal Year Sales:$17.5M
- Private
- US
Dow Jones Description
Founded in 1997, Tru-Si Technologies, Inc. serves the global semiconductor industry with innovative technologies for thin wafer processes and new chip-to-chip interconnection structures. Thin wafers are key in producing increasingly smaller, higher density, more functional and less costly chips used in wireless, portable, smart-card, networking and Internet applications. Tru-Si delivers solutions for damage-free wafer thinning, thin-wafer damage and stress removal, ultra-thin wafer handling, flexible integration of thin-wafer processing tools and advanced technologies focused on enabling new generations of 3D system-in-a-package (SIP) devices. In June 2001, Tru-Si introduced the industry's first flexible integration of ultra-thin wafer operations. Incorporating its NoTouchTM handling technology, this integration facilitates transfer of wafers within a tool and from tool-to-tool, resolving a major obstacle to the processing of thin wafers. To ensure that customers can use tools of their choice for thinning operations like grinding, de-taping, film frame mounting and dicing, the Company has begun to establish alliances with the manufacturers of those technologies and has initiated efforts to establish industry standards for integration-related components through major industry trade organizations. For total thinning solutions in demanding damage and stress-free applications, Tru-Si can integrate its proven ADP processing equipment to deliver cost efficient manufacturing...
Number of Employees 14
Peer Companies
NAICS Code Semiconductor and Related Device Manufacturing: 334413
News & Analysis
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tru-si technologies inc. - All News and Analysis
Entegris and Tru-Si Technologies Join Forces in Silicon Wafer Handling Initiative; New Alliance Brings Industry Leaders Together to Create Thin Wafer Handling Solutions
Business Editors/High-Tech Writers
Tru-Si Technologies and OSE-USA Announce Joint Thin-Wafer Development Program; Goal is Higher-Yield Production of Stacked Die Assemblies
Business Editors/High-Tech Writers SUNNYVALE, Calif.--BUSINESS WIRE--March 5, 2002 Tru-Si Technologies, Inc., and OSE-USA today announced a joint development effort to create strong, ultra-thin microchip die that can be stacked and interconnected with up to four die per package, with very high yields in volume manufacturing. An innovator...
Tru-Si Establishes Product Deployment Business Unit; New Organization Formalizes Customer Advocacy
Business Editors/High-Tech Writers SUNNYVALE, Calif.--BUSINESS WIRE--Jan. 21, 2002 Tru-Si Technologies, Inc. has created a Product Deployment business unit to support increased shipments of the company's products for silicon wafer thinning, handling and related chip-to-chip interconnection applications. An industry veteran, Frank Kretz, 42, has been named to head the...
Tru-Si Technologies Penetrates Southeast Asia Market With Dry Etch System Order; Order From Leading U.S. Semiconductor Maker Slated for New Thin-Wafer Process Line in Pacific Rim
Business Editors/High-Tech Writers SUNNYVALE, Calif.--BUSINESS WIRE--Oct. 30, 2001 Tru-Si Technologies today announced that it has secured an order for its proprietary atmospheric downstream plasma ADP chemical dry etch equipment from a major U.S. semiconductor manufacturer, for installation in that firm's Southeast Asia facility. Scheduled for delivery in the...
Tru-Si Announces Flexible Integration Program for Handling Ultra-Thin Wafers
Business Editors/High-Tech Writers SUNNYVALE, Calif.--BUSINESS WIRE--June 18, 2001 Tru-Si Technologies today announced that, in response to customer demand, it has initiated a flexible integration program and completed comprehensive customer site testing of the industry's first tool-to-tool handling solution used in ultra-thin wafer operations. Using its patented NoTouchTM wafer...
Industry Veterans Join Tru-Si Technologies
Business Editors/High-Tech Writers SUNNYVALE, Calif.--BUSINESS WIRE--April 20, 2001 Tru-Si Technologies, a leading innovator of all-dry silicon wafer thinning technology, today announced that Dana Ditmore, Phil Marcoux and John Baliga have joined the company. Ditmore is Tru-Si's President and Chief Operating Officer. Marcoux reports to Ditmore as Vice President...
Tru-Si Technologies Secures Order for European Installation From Leading Semiconductor Manufacturer
Business Editors/High-Tech Writers SEMICON West SUNNYVALE, Calif.--BUSINESS WIRE--July 5, 2000 New Damage-free Handling Technology Critical for Customer's Ultra-thin Etching Requirements Tru-Si Technologies, Inc. (Tru-Si), a leading provider of atmospheric downstream plasma ADP processing equipment to the semiconductor industry, today announced that it has secured an...
Tru-Si Technologies Secures Order From Leading U.S. Semiconductor Manufacturer; Order Reflects Growing Trend Toward Use of Dry-etch Technology
Business Editors, Technology Writers SUNNYVALE, Calif.--BUSINESS WIRE--May 17, 2000 Tru-Si Technologies, Inc. (Tru-Si), a leading provider of atmospheric downstream plasma ADP processing equipment to the semiconductor industry, today announced that it has secured an order for its dry-etch technology from a prominent U.S. semiconductor manufacturer. The order...
Tru-Si and LSI Logic Establish Packaging Development Program
Business Editors/High-Tech Writers SUNNYVALE, Calif.--BUSINESS WIRE--Feb. 22, 2000 Tru-Si Technologies, Inc. and LSI Logic Corporation (NYSE:LSI) today announced the establishment of a strategic development program to evaluate Tru-Si's plasma-thinning technology and equipment for use in LSI Logic's chip-scale packaging, flip-chip and multi-chip packaging. ...
Tru-Si Technologies Makes Wafer Stacking a Possibility
Sunnyvale, Calif. -- Tru-Si Technologies, manufacturer of atmospheric downstream plasma processing equipment, said it has found a way to hurdle the brick wall blocking the progress of Moore's Law. Instead of shrinking circuits smaller and smaller in silicon wafers, the company's ADP etching process can be applied to enable...
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