BNET Industries
Last Fiscal Year Sales:$12.0M
- Private
- US
Dow Jones Description
Provider of Wafer-Level Packaging Solutions
Number of Employees 80
Contact Information
140 S Centre Ct Ste 600
PO Box 14584
Morrisville, North Carolina 27560
(919) 941-0606
Peer Companies
NAICS Code Semiconductor and Related Device Manufacturing: 334413
News & Analysis
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unitive electronics inc. - All News and Analysis
Unitive Electronics Qualifies in Production NEXX Systems' Stratus Electro-deposition System
- 2004-07-12
BILLERICA, Mass. -- NEXX Systems today announced the acceptance of its Stratus 100 electro-deposition system at the Unitive Electronics, Inc. plant in Research Triangle Park, NC. Unitive will use NEXX's electroplating system for development of its lead-free and tin-lead based alloys.
PACKAGING: Unitive Installs NEXX Tools.
- 2003-03-01
NEXX Systems (90 Industrial Way, Wilmington, MA 01887-4610; Tel: 978/284-4980, Fax: 978/284-4970) announced that the Unitive Electronics, Inc. plant in Research Triangle Park, North Carolina, has accepted the company's Nimbus 300 sputter deposition system. This equipment was selected after an extensive evaluation for deposition of the under bump metallurgy UBM...
NEXX Systems Installs Nimbus Tool at Unitive in NC and Ships First 300 mm Tool to Taiwan
- 2003-02-26
Business Editors/High-Tech Writers WILMINGTON, Mass.--BUSINESS WIRE--Feb. 26, 2003 NEXX Systems today announced the acceptance of a Nimbus 300 sputter deposition system at the Unitive Electronics, Inc. plant in Research Triangle Park, NC. The Nimbus was selected after an extensive evaluation and is the lowest cost-of-ownership sputtering system on...
Unitive To Install 300-mm Line.
- 2002-09-01
Unitive Electronics, Inc. (P.O. Box 14584, Research Triangle Park NC 27709-14584; Tel: 919/941-0606, Fax: 919/941-5097), announced its plans to install a 300-mm production line and support for electroplated wafer bumping and wafer-level packaging at the company's contract services facility in Hsinchu, Taiwan. The line will be available through Unitive,...
Amkor, Unitive Electronics Sign Licensing Agreement for New Flip Chip Wafer Bumping Technology Ideal for Communications
- 2000-04-11
Business Editors/High-Tech Writers WEST CHESTER, Pa.--BUSINESS WIRE--April 10, 2000 Amkor Technology, Inc., (Nasdaq:AMKR) and Unitive Advanced Semiconductor Packaging have signed a 10-year technology transfer and licensing agreement that will add electro-plated wafer bumping capability to Amkor's recently announced internal wafer bumping manufacturing line planned for Korea. The...
Amkor, Unitive Electronics Sign Licensing Agreement for New Flip Chip Wafer Bumping Technology Ideal for Communications
- 2000-04-10
Business Editors/High-Tech Writers WEST CHESTER, Pa.--BUSINESS WIRE--April 10, 2000 Amkor Technology, Inc., (Nasdaq:AMKR) and Unitive Advanced Semiconductor Packaging have signed a 10-year technology transfer and licensing agreement that will add electro-plated wafer bumping capability to Amkor's recently announced internal wafer bumping manufacturing line planned for Korea. The...
Imperial Bank Funds Working Capital Loan for Unitive Electronics Inc
- 1998-12-17
RESTON, Va.--BUSINESS WIRE--Dec. 17, 1998--Imperial Bank's Emerging Growth Division EGD recently closed a $2.5 million working capital loan for Unitive Electronics Inc., to assist the company in providing high-quality flip chip bumping services to the electronics industry, announced Stacy Carlson, a managing director of Imperial's EGD. The loan will...
Flip chip moves accelerate
- 1996-07-08
New York--The long march to bring down the cost of flip chip wafer bumping has taken two steps forward in recent days, with a joint venture started by Delco Electronics and Kulicke & Soffa Industries earlier this year beginning construction in Phoenix of its first plant, while non-profit North Carolina-based...
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