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wafer thickness

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Wafer Thickness, Texture and Performance of Multi-crystalline Silicon Solar Cells
This paper discusses the influence of wafer thickness and surface texturing of silicon solar cells on cell results which has been investigated using neighboring multi-crystalline silicon wafers with thickness ranging from 150 ?m to 350 ?m and isotropic NaOH or acid etched. It was found experimentally that Voc decreases nearly...
Tags: Silicon, Performance, Solar Cell, Energy Research Centre Of The Netherlands, Wafer Thickness, Semiconductors, Hardware
White papers 2004-05-05

Additional Resources

Nanometrics Introduces New Film Thickness Calibration Standards
SUNNYVALE, Calif.--BUSINESS WIRE--Sept. 24, 1996--Nanometrics Inc. (NASDAQ:NANO) announced today the introduction of new thin film thickness metrology standard sets -- NanoStandardsR.Six highly stable, thermally grown oxide films, ranging in thickness from 10nm to 1,000nm are provided on either 150mm or 200mm diameter high grade silicon wafers. "By growing the...
Tags: Business Wire, HARDWARE, Quality, Semiconductors, standards, Sunnyvale, wafer
Research articles 1996-09-24
300mm thickness and composition metrology for ultra-thin films.(MANUFACTURING)
Thermo Electron Corporation's fully automated Theta 300XT tool features twin loadports and full host integration and pattern recognition for measurement of product wafers. Them 300XT features 200 and 300mm wafer mapping of ... Thermo Electron Corporation's fully automated Theta 300XT tool features twin...
Tags: manufacturing, Thermo Electron Corp., wafer
Research articles 2005-11-01
Infrared tool measures wafers in one pass.(NEWSBRIEFS)
To help the semiconductor industry measure 300-mm wafers, researchers at the National Institute of Standards and Technology NIST have developed an infrared instrument that measures differences in thickness across a 300-mm wafer. The researchers hope the tool will eventually allow them to establish a new calibration...
Tags: HARDWARE, NIST, researcher, Semiconductors, tool, wafer
Research articles 2005-08-01
KLA-Tencor Develops Wafer-Stress Management Tool - ASET-F5x thin-film measurement tool - Brief Article - Product Announcement
KLA-TENCOR CORP. HAS INTRODUCED AN OPTION FOR ITS ASET-F5x thin-film measurement tool that measures wafer bow and wafer stress on 300mm wafers. San Jose-based KLA-Tencor (nasdaq: KLAC) said integrating these two capabilities into a single platform will allow chipmakers to reduce their capital expenditures and free up floor space in...
Tags: KLA-Tencor Corp., wafer
Research articles 2001-06-18
Metal Film Thickness Standards Enable NIST-Traceable Calibration.(Brief Article)
Semiconductor manufacturers use electrical probe tools and other noncontacting technologies to monitor metal film thickness. Although silicon wafer resistivity and sheet resistance standards have been available for use with four-point probe and eddy-current measurement tools, there have been no process-relevant metal film thickness and sheet...
Tags: calibration, NIST, Quality, standards
Research articles 2001-06-01
Siemens Selects Therma-Wave As Supplier Of Choice for All Film Thickness Measurements At Phase II, Dresden, Germany and New, North Tyneside, England 16- and 64-Megabit DRAM Wafer Fabs; Multiple-system, multiple-fab order will include the 275th Opti-Probe
FREMONT, Calif.--BUSINESS WIRE--Sept. 10, 1996--Therma-Wave announced today that Siemens Semiconductor Division, the largest European-based manufacturer of integrated circuits, has placed a multiple-system order, valued at over $9 million, for Therma-Wave's Opti-Probetm film thickness measurement and Therma-Probetm ion implant monitoring systems. The systems will be installed at three Siemens semiconductor...
Tags: Siemens AG, supplier
Research articles 1996-09-10
Trina Solar: Still Struggling to Bring Manufacturing Costs in Line With Falling Prices
Jifan Gao, chairman and chief executive of Trina Solar, told analysts on the solar panel maker's second-quarter earnings call that he believed market confidence was returning to the photovoltaic sector and expected gross margin to stabilize going forward. Critical to Gao's optimistic modeling, however, are certain assumptions on the vertically...
Tags: Watt, Trina Solar, Manufacturing Cost, Manufacturing, David Phillips
Blog posts 2009-09-02
Tru-Si Technologies Thinning Wafers Beyond CMP
Thinner and thinner semiconductors are being required for applications such as smart cards and laptop computers. It is generally believed that silicon wafers cannot be thinned to thicknesses below 200-micron. However, Hitachi announced in December that it had produced chips with a wafer thickness of 50 microns. ADP technology, which...
Tags: Tru-Si Technologies Inc.
Research articles 1998-07-06
Interference patterns allow measurement of nanoscale.(MATERIALS SCIENCE/R & D)
A new instrument that accurately measures differences in thickness across a 300-mm semiconductor wafer with a repeatability of 5 nm has reportedly been developed by researchers at the National Institute of Standards and Technology NIST, Gaithersbur A new instrument that accurately measures differences in thickness ...
Tags: NIST, wafer
Research articles 2005-10-01
Film standard.(New Products)
FTS-20 is a gate oxide film thickness standard certified for 2 nm. It has a 200 or 300 nun SEMI standard silicon wafer, which has a uniform, thermally grown Si[O.sub.2] film on the polished surface. It should be stored only in its original wafer container to avoid...
Tags: HARDWARE, Semiconductor Equipment and Materials International, Semiconductors, uniform
Research articles 2005-03-01
Substrate with peaked surface. (Ceramics).(Ibiden Co Ltd )(Brief Article)
Ibiden Co Ltd has developed a ceramic semiconductor substrate which is suitable for use in manufacturing a variety of items such as a hot plate, an electrostatic chuck, or a wafer prober, and which has better thermal shock resistance and heat uniformity than existing products. ...
Tags: Ibiden Co. Ltd.
Research articles 2003-04-01
AG Associates Introduces Breakthrough RTP System for Sub-0.25 Micron Steam-Based Thermal Applications
SAN JOSE, Calif.--BUSINESS WIRE--July 8, 1998--Editorial Summary As devices move beyond the quarter micron threshold, gate oxide thickness on the wafer becomes significantly thinner -- requiring precise, cost-effective steam-based thermal processes that deliver superior control of oxide thickness and quality. Conventional furnace techniques are proving incapable of delivering these advanced...
Tags: Micron Technology Inc.
Research articles 1998-07-08
Where no man has gone before
Lay a dime down flat. Shave it into 10 thin slices. The last slice is the thickness of a human body cell. Shave the human cell into 10 thin slices and you have a red blood cell. Slice it and you have a nerve cell. Slice it and you have...
Tags: cell, HARDWARE, Nanotechnology, National Science Foundation, Semiconductors
Research articles 2001-01-22
FTIR Metrology Tool.(Accent Optical Technologies)(Brief Article)
Illumina FTIR metrology tool is for III-V process control. It is an optical, non-contact tool that provides accurate and repeatable characterization of multilayer, compound semiconductor wafer parameters such as epi thickness and doping concentration. Features include high throughput, thickness measurements from [less than]0.1 to [greater ...
Tags: Accent Optical Technologies Inc.
Research articles 2001-10-01
Nanometrics Debuts NanoSpec Film Metrology System - Product Announcement
Metrology company Nanometrics Inc., Sunnyvale, Calif., has rolled out the latest version of its NanoSpec 9000 thin film measurements system, the NanoSpec 9200, an automated film metrology system designed to complement and improve equipment efficiency. The company said that it features the latest generation spectroscopic reflectometer, pattern recognition, auto-focus, and...
Tags: Semiconductor Equipment and Materials International
Research articles 2000-06-26
L-GAGE Laser Gauging Sensors.(product from Banner Engineering Corp.)(Brief Article)
L-GAGE laser gauging sensors feature a maximum resolution of 0.01 mm and use both analog and discrete outputs. TEACH mode programming allows users to set custom-sized sensing windows, and place them anywhere within the 45 to 60 mm range using a single pushbutton. Applications include exacting...
Tags: Banner Engineering Corp.
Research articles 1999-04-05
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