BNET Industries

Winbond Electronics Corp.

WEC is in the Technology Industry

Market Cap:$5.6B
Last Fiscal Year Sales:$876.0M
  • Public
  • TW
Dow Jones Description

Winbond Electronics Corp. was founded in September 1987 in Hsinchu Science Park, Taiwan and has been publicly traded on the Taiwan Stock Exchange since 1995. In July 2008, the headquarter is relocated to Central Taiwan Science Park where the newly built 300mm water fab. The site is mainly focusing on research & development and production, of which the process technology covers from 0.11µm~70nm. Today, Winbond focuses on the Memory Products design and manufacturing with three main business groups?DRAM Product Business Group, Memory IC Manufacturing Business Group, and Flash Memory IC Business Group. The DRAM products have made significant advances in the mobile memory market. Winbond?s Low Power DRAM is designed to meet the need of portable multimedia devices for high-performance memory with low power consumption. In addition, the high performance and reliability of our SDRAM and Pseudo SRAM products have been well received by our customers.

Number of Employees 3,659
Contact Information

No 4 Creation Rd 3

Science Based Industrial Park

Hsinchu 300

www.winbond.com...

(886) 35770066

NAICS Code Semiconductor and Related Device Manufacturing: 334413

Recent Events

  • Elpida, Winbond enter outsourcing agreement

    11/15/09 - Licensing / Contract - View Story

  • Elpida and Winbond Explore Manufacturing Partnership.

    11/14/09 - Licensing / Contract - View Story

  • Qimonda establishes US Based Licensing Group

    10/12/09 - Joint Venture / Alliance - View Story

News & Analysis

winbond electronics corp. - All News and Analysis

Decision Makers

Name (plus bio) Position
In-Shek Hsu President & COO
James Win CFO & Vice President
Chen-Hsi Lin Vice President, Res & Development
Jui-Wei Lin Vice President, Quality
Pei-Ming Cheng Vice President, Sales
Ty Chan Vice President, Sales
Wilson Wen Vice President, Admin
Yuan-Mou Su Vice President, Memory
Yung Chin Vice President & General Auditor

Board of Directors

Name (plus bio) Position
Arthur Yu-Chieng Chiao Chairman & CEO
Ching Chu Chang Vice Chairman & Deputy CEO
Arthur Chang Chiao Board of Directors
Chin-Han Cheng Board of Directors
Keh-Shew Lu Board of Directors
Kuang-Yi Chiu Board of Directors
Lu-Pau Hau Board of Directors
Matthew Chiang Miau Board of Directors
Robert Hsu Board of Directors
Robert Mao Board of Directors
Ting-Piao Chiao Board of Directors
Yu-Lang Mao Board of Directors

Organization Position Status
Winbond Electronics Corporation Chairman & CEO Current

Organization Position Status
Winbond Electronics Corporation Vice Chairman & Deputy CEO Current
Winbond Electronics Corporation President Former
Winbond Electronics Corporation Board of Directors Former

Organization Position Status
Winbond Electronics Corporation President & COO Current

Organization Position Status
Winbond Electronics Corporation CFO & Vice President Current

Organization Position Status
Winbond Electronics Corporation Vice President, Res & Development Current

Organization Position Status
Winbond Electronics Corporation Vice President, Quality Current

Organization Position Status
Winbond Electronics Corporation Vice President, Sales Current

Organization Position Status
Winbond Electronics Corporation Vice President, Sales Current

Organization Position Status
Winbond Electronics Corporation Vice President, Admin Current

Organization Position Status
Winbond Electronics Corporation Vice President, Memory Current

Organization Position Status
Winbond Electronics Corporation Vice President & General Auditor Current
Winbond Electronics Corporation Board of Directors Current

Organization Position Status
Winbond Electronics Corporation Board of Directors Current
Winbond Electronics Corporation Chairman Former

Organization Position Status
Winbond Electronics Corporation Board of Directors Current

Organization Position Status
Winbond Electronics Corporation Board of Directors Current

Organization Position Status
Winbond Electronics Corporation Board of Directors Current

Organization Position Status
Winbond Electronics Corporation Board of Directors Current

Organization Position Status
Winbond Electronics Corporation Board of Directors Current

Organization Position Status
Winbond Electronics Corporation Board of Directors Current

Robert Mao is Chief Executive Officer of 3Com. He leads the company's global operations and strategy, including the company’s H3C business in China. Mr. Mao is a current member of the 3Com Board of Directors, and was most recently 3Com’s Executive Vice President, Corporate Development. Mao has more than 30 years of experience in the telecommunications and IT industries. Before joining 3Com, Mr. Mao was President and Chief Executive Officer of Greater China for Nortel Networks from September 1997 to May 2006 and Regional President of Greater China for Alcatel from September 1995 to September 1997. In these positions, he managed operations in the People’s Republic of China, Taiwan, Hong Kong and Macao. Mr. Mao also held senior managerial and technical positions at Alcatel and ITT in Asia and the United States. He is a past Vice Chairman (2003-2005) of the Board of Governors of the Pacific Telecommunication Council. He also serves on the Board of Hurray! Holding Co., Ltd., a wireless value-added services provider. Mao holds a master’s degree from Cornell University in material science and metallurgical engineering and earned a master’s in management from MIT.

Organization Position Status
3Com Corporation Chief Executive Officer Current
Hurray! Holding Co., Ltd. Board of Directors Current
Hurray Board of Directors Current
Winbond Electronics Corporation Board of Directors Current
3Com Corporation Board of Directors Current
Nortel Networks Corporation President & Chief Executive Officer, Greater China Former
Alcatel President Former
3Com Corporation Executive Vice President, Corporate Development Former
Massachusetts Institute of Technology Master degree in Management Former
Cornell University Master of Science degree in Engineering Former

Organization Position Status
Winbond Electronics Corporation Board of Directors Current

Organization Position Status
Winbond Electronics Corporation Board of Directors Current

Executive News

  • TSMC shakes up Vanguard

    EE Times - 5/18/09 - View Story

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WEC $47.97 -0.110 (-0.23% )
Volume 786,414
Shares Outstanding 116.9M
Market Cap 5.6B
Year High 48.69
Year Low 36.31
Earnings Per Share 3.090
P/E Ratio 15.5243
Dividend 1.35
Yield 2.8143
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IndustryTop Rated

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