<![CDATA[Winbond Electronics Corp. | Company News & Executive Profiles | BNET]]> en-us <![CDATA[Winbond 16Mb, 32Mb Serial Flash Memories Production-Released; Set Course for Next Generation]]> Mon, 25 Jun 2007 23:59:59 -0700 <![CDATA[TAIWAN: Construction plans for proposed $252,000,000 wafer plant, WINBOND ELECTRONICS CORP. [Taiwan] - Order #: 022905.]]> Tue, 01 Feb 2005 23:59:59 -0800 <![CDATA[TAIWAN: Construction plans for proposed $1,300,000,000 chip plant, WINBOND ELECTRONICS CORP. [Taiwan] - Order #: 310304.]]> Mon, 01 Mar 2004 23:59:59 -0800 <![CDATA[TAIWAN: Construction plans for proposed $230,000,000 wafer production expansion project, WINBOND ELECTRONICS CORP. [Taiwan] - Order #: 018703.]]> Wed, 01 Jan 2003 23:59:59 -0800 <![CDATA[Infineon To Cooperate With Taiwanese Winbond And Mosel Vitelic To Secure Higher Memory Chip Production Capacity.]]> Mon, 11 Mar 2002 23:59:59 -0800 IFX IFX <![CDATA[Infineon to Cooperate with Taiwanese Winbond and Mosel Vitelic to Secure Higher Memory Chip Production Capacity]]> Mon, 11 Mar 2002 23:59:59 -0800 IFX IFX <![CDATA[Winbond Launches Company's First ACPI Power Control IC]]> Mon, 01 Oct 2001 23:59:59 -0700 <![CDATA[Winbond Launches Industry's First Hardware Monitor IC Featuring Speech Function and ASF Specification Compliance]]> Wed, 26 Sep 2001 23:59:59 -0700 <![CDATA[Winbond Launches New Series of Smart@IO Controller ICs Featuring Reader and Interface Support for Three Major Memory Card Standards and SMART Card]]> Mon, 17 Sep 2001 23:59:59 -0700 <![CDATA[Winbond To Provide Rambus RDRAM Memory Devices; Leading Taiwan DRAM Company To Begin Volume Production In 2001.]]> Wed, 27 Jun 2001 23:59:59 -0700 RMBS RMBS